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Reel/Frame:057694/0374   Pages: 381
Recorded: 08/03/2021
Attorney Dkt #:FSC - SCI
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1473
Page 7 of 15
Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
1
Patent #:
7824999
Issue Dt:
11/02/2010
Application #:
12017742
Filing Dt:
01/22/2008
Publication #:
US20080113482
Pub Dt:
05/15/2008
Title:
METHOD FOR ENHANCING FIELD OXIDE
2
Patent #:
7982265
Issue Dt:
07/19/2011
Application #:
12018166
Filing Dt:
01/22/2008
Publication #:
US20080150020
Pub Dt:
06/26/2008
Title:
TRENCHED SHIELD GATE POWER SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
3
Patent #:
NONE
Issue Dt:
Application #:
12020286
Filing Dt:
01/25/2008
Publication #:
US20090189261
Pub Dt:
07/30/2009
Title:
Ultra-Thin Semiconductor Package
4
Patent #:
8063472
Issue Dt:
11/22/2011
Application #:
12020855
Filing Dt:
01/28/2008
Publication #:
US20090189266
Pub Dt:
07/30/2009
Title:
SEMICONDUCTOR PACKAGE WITH STACKED DICE FOR A BUCK CONVERTER
5
Patent #:
7696612
Issue Dt:
04/13/2010
Application #:
12020892
Filing Dt:
01/28/2008
Publication #:
US20090189262
Pub Dt:
07/30/2009
Title:
MULTIPHASE SYNCHRONOUS BUCK CONVERTER
6
Patent #:
NONE
Issue Dt:
Application #:
12024847
Filing Dt:
02/01/2008
Publication #:
US20090194857
Pub Dt:
08/06/2009
Title:
Thin Compact Semiconductor Die Packages Suitable for Smart-Power Modules, Methods of Making the Same, and Systems Using the Same
7
Patent #:
7846813
Issue Dt:
12/07/2010
Application #:
12025514
Filing Dt:
02/04/2008
Publication #:
US20090197053
Pub Dt:
08/06/2009
Title:
METHOD AND APPARATUS FOR BONDED SUBSTRATES
8
Patent #:
8198710
Issue Dt:
06/12/2012
Application #:
12025798
Filing Dt:
02/05/2008
Publication #:
US20090194855
Pub Dt:
08/06/2009
Title:
FOLDED LEADFRAME MULTIPLE DIE PACKAGE
9
Patent #:
8063474
Issue Dt:
11/22/2011
Application #:
12026742
Filing Dt:
02/06/2008
Publication #:
US20090194887
Pub Dt:
08/06/2009
Title:
EMBEDDED DIE PACKAGE ON PACKAGE (POP) WITH PRE-MOLDED LEADFRAME
10
Patent #:
NONE
Issue Dt:
Application #:
12026952
Filing Dt:
02/06/2008
Publication #:
US20090194856
Pub Dt:
08/06/2009
Title:
MOLDED PACKAGE ASSEMBLY
11
Patent #:
7808101
Issue Dt:
10/05/2010
Application #:
12028051
Filing Dt:
02/08/2008
Publication #:
US20090200657
Pub Dt:
08/13/2009
Title:
3D SMART POWER MODULE
12
Patent #:
7855415
Issue Dt:
12/21/2010
Application #:
12032123
Filing Dt:
02/15/2008
Publication #:
US20080135931
Pub Dt:
06/12/2008
Title:
POWER SEMICONDUCTOR DEVICES HAVING TERMINATION STRUCTURES AND METHODS OF MANUFACTURE
13
Patent #:
8143124
Issue Dt:
03/27/2012
Application #:
12032599
Filing Dt:
02/15/2008
Publication #:
US20080138953
Pub Dt:
06/12/2008
Title:
METHODS OF MAKING POWER SEMICONDUCTOR DEVICES WITH THICK BOTTOM OXIDE LAYER
14
Patent #:
8349717
Issue Dt:
01/08/2013
Application #:
12035758
Filing Dt:
02/22/2008
Publication #:
US20080138954
Pub Dt:
06/12/2008
Title:
HIGH VOLTAGE LDMOS
15
Patent #:
8120169
Issue Dt:
02/21/2012
Application #:
12037428
Filing Dt:
02/26/2008
Publication #:
US20090212403
Pub Dt:
08/27/2009
Title:
THERMALLY ENHANCED MOLDED LEADLESS PACKAGE
16
Patent #:
NONE
Issue Dt:
Application #:
12037471
Filing Dt:
02/26/2008
Publication #:
US20090212405
Pub Dt:
08/27/2009
Title:
STACKED DIE MOLDED LEADLESS PACKAGE
17
Patent #:
7732876
Issue Dt:
06/08/2010
Application #:
12038184
Filing Dt:
02/27/2008
Publication #:
US20080142883
Pub Dt:
06/19/2008
Title:
POWER TRANSISTOR WITH TRENCH SINKER FOR CONTACTING THE BACKSIDE
18
Patent #:
NONE
Issue Dt:
Application #:
12039011
Filing Dt:
02/28/2008
Publication #:
US20080197407
Pub Dt:
08/21/2008
Title:
Power Semiconductor Devices with Barrier Layer to Reduce Substrate Up-Diffusion and Methods of Manufacture
19
Patent #:
8143123
Issue Dt:
03/27/2012
Application #:
12041546
Filing Dt:
03/03/2008
Publication #:
US20080199997
Pub Dt:
08/21/2008
Title:
METHODS OF FORMING INTER-POLY DIELECTRIC (IPD) LAYERS IN POWER SEMICONDUCTOR DEVICES
20
Patent #:
7972906
Issue Dt:
07/05/2011
Application #:
12044314
Filing Dt:
03/07/2008
Publication #:
US20090224383
Pub Dt:
09/10/2009
Title:
SEMICONDUCTOR DIE PACKAGE INCLUDING EXPOSED CONNECTIONS
21
Patent #:
7915721
Issue Dt:
03/29/2011
Application #:
12046734
Filing Dt:
03/12/2008
Publication #:
US20090230518
Pub Dt:
09/17/2009
Title:
SEMICONDUCTOR DIE PACKAGE INCLUDING IC DRIVER AND BRIDGE
22
Patent #:
8018054
Issue Dt:
09/13/2011
Application #:
12046939
Filing Dt:
03/12/2008
Publication #:
US20090230536
Pub Dt:
09/17/2009
Title:
SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DICE
23
Patent #:
7768108
Issue Dt:
08/03/2010
Application #:
12047028
Filing Dt:
03/12/2008
Publication #:
US20090230537
Pub Dt:
09/17/2009
Title:
SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP
24
Patent #:
7977715
Issue Dt:
07/12/2011
Application #:
12049788
Filing Dt:
03/17/2008
Publication #:
US20090230468
Pub Dt:
09/17/2009
Title:
LDMOS DEVICES WITH IMPROVED ARCHITECTURES
25
Patent #:
7595524
Issue Dt:
09/29/2009
Application #:
12049996
Filing Dt:
03/17/2008
Publication #:
US20080164519
Pub Dt:
07/10/2008
Title:
POWER DEVICE WITH TRENCHES HAVING WIDER UPPER PORTION THAN LOWER PORTION
26
Patent #:
7485532
Issue Dt:
02/03/2009
Application #:
12052135
Filing Dt:
03/20/2008
Publication #:
US20080166846
Pub Dt:
07/10/2008
Title:
METHOD OF FORMING TRENCH GATE FETS WITH REDUCED GATE TO DRAIN CHARGE
27
Patent #:
8110447
Issue Dt:
02/07/2012
Application #:
12052871
Filing Dt:
03/21/2008
Publication #:
US20090236711
Pub Dt:
09/24/2009
Title:
METHOD OF MAKING AND DESIGNING LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
28
Patent #:
7893548
Issue Dt:
02/22/2011
Application #:
12053707
Filing Dt:
03/24/2008
Publication #:
US20090236702
Pub Dt:
09/24/2009
Title:
SIP SUBSTRATE
29
Patent #:
7956589
Issue Dt:
06/07/2011
Application #:
12072259
Filing Dt:
02/25/2008
Title:
COMPENSATION NETWORK FOR ERROR AMPLIFIER OF A LOW DROPOUT REGULATOR
30
Patent #:
7710084
Issue Dt:
05/04/2010
Application #:
12077463
Filing Dt:
03/19/2008
Title:
SAMPLE AND HOLD TECHNIQUE FOR GENERATING AN AVERAGE OF SENSED INDUCTOR CURRENT IN VOLTAGE REGULATORS
31
Patent #:
7723972
Issue Dt:
05/25/2010
Application #:
12077475
Filing Dt:
03/19/2008
Title:
REDUCING SOFT START DELAY AND PROVIDING SOFT RECOVERY IN POWER SYSTEM CONTROLLERS
32
Patent #:
7839666
Issue Dt:
11/23/2010
Application #:
12080274
Filing Dt:
04/02/2008
Title:
OPTIMIZING OPERATION OF DC-TO-AC POWER CONVERTER
33
Patent #:
7719026
Issue Dt:
05/18/2010
Application #:
12098546
Filing Dt:
04/07/2008
Publication #:
US20080253046
Pub Dt:
10/16/2008
Title:
UN-ASSISTED, LOW-TRIGGER AND HIGH-HOLDING VOLTAGE SCR
34
Patent #:
NONE
Issue Dt:
Application #:
12099348
Filing Dt:
04/08/2008
Publication #:
US20090250793
Pub Dt:
10/08/2009
Title:
BPSG FILM DEPOSITION WITH UNDOPED CAPPING
35
Patent #:
7952204
Issue Dt:
05/31/2011
Application #:
12102793
Filing Dt:
04/14/2008
Publication #:
US20090256252
Pub Dt:
10/15/2009
Title:
SEMICONDUCTOR DIE PACKAGES WITH MULTIPLE INTEGRATED SUBSTRATES, SYSTEMS USING THE SAME, AND METHODS USING THE SAME
36
Patent #:
NONE
Issue Dt:
Application #:
12102799
Filing Dt:
04/14/2008
Publication #:
US20090256245
Pub Dt:
10/15/2009
Title:
Stacked Micro-Module Packages, Systems Using the Same, and Methods of Making the Same
37
Patent #:
8101996
Issue Dt:
01/24/2012
Application #:
12103701
Filing Dt:
04/15/2008
Publication #:
US20090256196
Pub Dt:
10/15/2009
Title:
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE STRUCTURES AND METHODS
38
Patent #:
NONE
Issue Dt:
Application #:
12103838
Filing Dt:
04/16/2008
Publication #:
US20090261462
Pub Dt:
10/22/2009
Title:
SEMICONDUCTOR PACKAGE WITH STACKED DIE ASSEMBLY
39
Patent #:
7655539
Issue Dt:
02/02/2010
Application #:
12103878
Filing Dt:
04/16/2008
Publication #:
US20090261388
Pub Dt:
10/22/2009
Title:
DICE BY GRIND FOR BACK SURFACE METALLIZED DIES
40
Patent #:
NONE
Issue Dt:
Application #:
12104182
Filing Dt:
04/16/2008
Publication #:
US20090261461
Pub Dt:
10/22/2009
Title:
SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS
41
Patent #:
7618884
Issue Dt:
11/17/2009
Application #:
12106646
Filing Dt:
04/21/2008
Publication #:
US20080227275
Pub Dt:
09/18/2008
Title:
METHOD AND DEVICE WITH DURABLE CONTACT ON SILICON CARBIDE
42
Patent #:
7745845
Issue Dt:
06/29/2010
Application #:
12107995
Filing Dt:
04/23/2008
Publication #:
US20090267110
Pub Dt:
10/29/2009
Title:
INTEGRATED LOW LEAKAGE SCHOTTKY DIODE
43
Patent #:
7863875
Issue Dt:
01/04/2011
Application #:
12108435
Filing Dt:
04/23/2008
Title:
NON-LINEAR CONTROL TECHNIQUES FOR IMPROVING TRANSIENT RESPONSE TO LOAD CURRENT STEP CHANGE
44
Patent #:
7910995
Issue Dt:
03/22/2011
Application #:
12109293
Filing Dt:
04/24/2008
Publication #:
US20090267146
Pub Dt:
10/29/2009
Title:
STRUCTURE AND METHOD FOR SEMICONDUCTOR POWER DEVICES
45
Patent #:
8815744
Issue Dt:
08/26/2014
Application #:
12109302
Filing Dt:
04/24/2008
Publication #:
US20090269896
Pub Dt:
10/29/2009
Title:
TECHNIQUE FOR CONTROLLING TRENCH PROFILE IN SEMICONDUCTOR STRUCTURES
46
Patent #:
8170070
Issue Dt:
05/01/2012
Application #:
12112136
Filing Dt:
04/30/2008
Publication #:
US20090116515
Pub Dt:
05/07/2009
Title:
METHOD AND CIRCUIT FOR INTERLEAVING, SERIALIZING AND DESERIALIZING CAMERA AND KEYPAD DATA
47
Patent #:
8107575
Issue Dt:
01/31/2012
Application #:
12112152
Filing Dt:
04/30/2008
Publication #:
US20090110130
Pub Dt:
04/30/2009
Title:
METHOD AND CIRCUIT FOR CHANGING MODES WITHOUT DEDICATED CONTROL PIN
48
Patent #:
8321598
Issue Dt:
11/27/2012
Application #:
12112176
Filing Dt:
04/30/2008
Publication #:
US20090106462
Pub Dt:
04/23/2009
Title:
METHOD AND CIRCUIT FOR CAPTURING KEYPAD DATA SERIALIZING/DESERIALIZING AND REGENERATING THE KEYPAD INTERFACE
49
Patent #:
7936008
Issue Dt:
05/03/2011
Application #:
12114575
Filing Dt:
05/02/2008
Publication #:
US20080211012
Pub Dt:
09/04/2008
Title:
STRUCTURE AND METHOD FOR FORMING ACCUMULATION-MODE FIELD EFFECT TRANSISTOR WITH IMPROVED CURRENT CAPABILITY
50
Patent #:
7843048
Issue Dt:
11/30/2010
Application #:
12115049
Filing Dt:
05/05/2008
Publication #:
US20090273067
Pub Dt:
11/05/2009
Title:
MULTI-CHIP DISCRETE DEVICES IN SEMICONDUCTOR PACKAGES
51
Patent #:
8158506
Issue Dt:
04/17/2012
Application #:
12115254
Filing Dt:
05/05/2008
Publication #:
US20090273082
Pub Dt:
11/05/2009
Title:
METHODS AND DESIGNS FOR LOCALIZED WAFER THINNING
52
Patent #:
7682877
Issue Dt:
03/23/2010
Application #:
12118222
Filing Dt:
05/09/2008
Publication #:
US20080213946
Pub Dt:
09/04/2008
Title:
SUBSTRATE BASED UNMOLDED PACKAGE
53
Patent #:
7777172
Issue Dt:
08/17/2010
Application #:
12123350
Filing Dt:
05/19/2008
Publication #:
US20080296478
Pub Dt:
12/04/2008
Title:
METHODS FOR REDUCING CROSS TALK IN OPTICAL SENSORS
54
Patent #:
7764054
Issue Dt:
07/27/2010
Application #:
12124953
Filing Dt:
05/21/2008
Title:
VOLTAGE REGULATOR WITH CURRENT-MODE DUAL-EDGE PULSE WIDTH MODULATION AND NON-LINEAR CONTROL
55
Patent #:
7514322
Issue Dt:
04/07/2009
Application #:
12125242
Filing Dt:
05/22/2008
Publication #:
US20080258213
Pub Dt:
10/23/2008
Title:
SHIELDED GATE FIELD EFFECT TRANSISTOR
56
Patent #:
7763939
Issue Dt:
07/27/2010
Application #:
12126108
Filing Dt:
05/23/2008
Publication #:
US20080290419
Pub Dt:
11/27/2008
Title:
LOW ON RESISTANCE CMOS TRANSISTOR FOR INTEGRATED CIRCUIT APPLICATIONS
57
Patent #:
8476886
Issue Dt:
07/02/2013
Application #:
12127670
Filing Dt:
05/27/2008
Title:
Differential Hysteretic DC-DC Converter
58
Patent #:
8138585
Issue Dt:
03/20/2012
Application #:
12128130
Filing Dt:
05/28/2008
Publication #:
US20090294936
Pub Dt:
12/03/2009
Title:
FOUR MOSFET FULL BRIDGE MODULE
59
Patent #:
NONE
Issue Dt:
Application #:
12128867
Filing Dt:
05/29/2008
Publication #:
US20090294985
Pub Dt:
12/03/2009
Title:
THIN CHIP SCALE SEMICONDUCTOR PACKAGE
60
Patent #:
7683693
Issue Dt:
03/23/2010
Application #:
12132267
Filing Dt:
06/03/2008
Publication #:
US20090256616
Pub Dt:
10/15/2009
Title:
HOT SWAP CONTROLLER WITH ZERO LOADED CHARGE PUMP
61
Patent #:
7760479
Issue Dt:
07/20/2010
Application #:
12132286
Filing Dt:
06/03/2008
Publication #:
US20090257162
Pub Dt:
10/15/2009
Title:
TECHNIQUE FOR COMBINING IN-RUSH CURRENT LIMITING AND SHORT CIRCUIT CURRENT LIMITING
62
Patent #:
8124981
Issue Dt:
02/28/2012
Application #:
12136140
Filing Dt:
06/10/2008
Publication #:
US20090302327
Pub Dt:
12/10/2009
Title:
RUGGED SEMICONDUCTOR DEVICE ARCHITECTURE
63
Patent #:
7897471
Issue Dt:
03/01/2011
Application #:
12142270
Filing Dt:
06/19/2008
Publication #:
US20090315155
Pub Dt:
12/24/2009
Title:
METHOD AND APPARATUS TO IMPROVE THE RELIABILITY OF THE BREAKDOWN VOLTAGE IN HIGH VOLTAGE DEVICES
64
Patent #:
7807576
Issue Dt:
10/05/2010
Application #:
12143510
Filing Dt:
06/20/2008
Publication #:
US20090315083
Pub Dt:
12/24/2009
Title:
STRUCTURE AND METHOD FOR FORMING A THICK BOTTOM DIELECTRIC (TBD) FOR TRENCH-GATE DEVICES
65
Patent #:
NONE
Issue Dt:
Application #:
12143675
Filing Dt:
06/20/2008
Publication #:
US20090315162
Pub Dt:
12/24/2009
Title:
Micro-Modules with Molded Passive Components, Systems Using the Same, and Methods of Making the Same
66
Patent #:
NONE
Issue Dt:
Application #:
12143680
Filing Dt:
06/20/2008
Publication #:
US20090315163
Pub Dt:
12/24/2009
Title:
Semiconductor Die Packages with Stacked Flexible Modules Having Passive Components, Systems Using the Same, and Methods of Making the Same
67
Patent #:
7745244
Issue Dt:
06/29/2010
Application #:
12144289
Filing Dt:
06/23/2008
Publication #:
US20090315171
Pub Dt:
12/24/2009
Title:
PIN SUBSTRATE AND PACKAGE
68
Patent #:
7872305
Issue Dt:
01/18/2011
Application #:
12146791
Filing Dt:
06/26/2008
Publication #:
US20090321817
Pub Dt:
12/31/2009
Title:
A SHIELDED GATE TRENCH FET WITH AN INTER-ELECTRODE DIELECTRIC HAVING A NITRIDE LAYER THEREIN
69
Patent #:
7884390
Issue Dt:
02/08/2011
Application #:
12168348
Filing Dt:
07/07/2008
Publication #:
US20090173993
Pub Dt:
07/09/2009
Title:
STRUCTURE AND METHOD OF FORMING A TOPSIDE CONTACT TO A BACKSIDE TERMINAL OF A SEMICONDUCTOR DEVICE
70
Patent #:
7936009
Issue Dt:
05/03/2011
Application #:
12170328
Filing Dt:
07/09/2008
Publication #:
US20100006928
Pub Dt:
01/14/2010
Title:
A SHIELDED GATE TRENCH FET WITH AN INTER-ELECTRODE DIELECTRIC HAVING A LOW-K DIELECTRIC THEREIN
71
Patent #:
7968982
Issue Dt:
06/28/2011
Application #:
12170523
Filing Dt:
07/10/2008
Publication #:
US20090072362
Pub Dt:
03/19/2009
Title:
THERMAL ENHANCED UPPER AND DUAL HEAT SINK EXPOSED MOLDED LEADLESS PACKAGE
72
Patent #:
8085516
Issue Dt:
12/27/2011
Application #:
12171924
Filing Dt:
07/11/2008
Title:
GROUND FAULT CIRCUIT INTERRUPTER WITH SELF TEST
73
Patent #:
8101500
Issue Dt:
01/24/2012
Application #:
12174030
Filing Dt:
07/16/2008
Publication #:
US20090179259
Pub Dt:
07/16/2009
Title:
SEMICONDUCTOR DEVICE WITH (110)-ORIENTED SILICON
74
Patent #:
7951688
Issue Dt:
05/31/2011
Application #:
12174863
Filing Dt:
07/17/2008
Publication #:
US20090181520
Pub Dt:
07/16/2009
Title:
METHOD AND STRUCTURE FOR DIVIDING A SUBSTRATE INTO INDIVIDUAL DEVICES
75
Patent #:
7863096
Issue Dt:
01/04/2011
Application #:
12175171
Filing Dt:
07/17/2008
Publication #:
US20100013087
Pub Dt:
01/21/2010
Title:
EMBEDDED DIE PACKAGE AND PROCESS FLOW USING A PRE-MOLDED CARRIER
76
Patent #:
NONE
Issue Dt:
Application #:
12178023
Filing Dt:
07/23/2008
Publication #:
US20100019362
Pub Dt:
01/28/2010
Title:
ISOLATED STACKED DIE SEMICONDUCTOR PACKAGES
77
Patent #:
7960211
Issue Dt:
06/14/2011
Application #:
12178043
Filing Dt:
07/23/2008
Publication #:
US20100019363
Pub Dt:
01/28/2010
Title:
SEMICONDUCTOR SYSTEM-IN-PACKAGE AND METHOD FOR MAKING THE SAME
78
Patent #:
NONE
Issue Dt:
Application #:
12180993
Filing Dt:
07/28/2008
Publication #:
US20090037621
Pub Dt:
02/05/2009
Title:
METHODOLOGY AND CIRCUIT FOR INTERLEAVING AND SERIALIZING/DESERIALIZING LCD, CAMERA, KEYPAD AND GPIO DATA ACROSS A SERIAL STREAM
79
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8129959
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Assignor
1
FAIRCHILD SEMICONDUCTOR CORPORATION
Exec Dt:
07/22/2021
Assignee
1
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700
PHOENIX, ARIZONA 85008
Correspondence name and address
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MD A700
PHOENIX, AZ 85008

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