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03/27/2012
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12511496
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07/29/2009
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02/03/2011
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07/17/2012
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12535093
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08/04/2009
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02/10/2011
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MODULAR DIE AND MASK FOR SEMICONDUCTOR PROCESSING
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03/05/2013
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12535597
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08/04/2009
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02/10/2011
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NONE
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12535963
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08/05/2009
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02/10/2011
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NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES
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12/28/2010
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12536618
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08/06/2009
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12/24/2009
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Title:
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WIDE BANDGAP DEVICE IN PARALLEL WITH A DEVICE THAT HAS A LOWER AVALANCHE BREAKDOWN VOLTAGE AND A HIGHER FORWARD VOLTAGE DROP THAN THE WIDE BANDGAP DEVICE
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11/02/2010
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12544159
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08/19/2009
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12/17/2009
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Title:
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FLEX CHIP CONNECTOR FOR SEMICONDUCTOR DEVICE
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10/02/2012
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12548202
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08/26/2009
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OPTIMIZATION OF PWM DC OPERATING POINT OF VOLTAGE REGULATORS WITH WIDE OPERATING RANGE
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06/28/2011
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12552384
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09/02/2009
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12/31/2009
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SHORT CHANNEL LV, MV, AND HV CMOS DEVICES
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02/15/2011
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12553464
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09/03/2009
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01/21/2010
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INTEGRATED COMPLEMENTARY LOW VOLTAGE RF-LDMOS
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12/06/2011
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12560007
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09/15/2009
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03/17/2011
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FOLDED LANDS AND VIAS FOR MULTICHIP SEMICONDUCTOR PACKAGES
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12/06/2011
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12561988
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09/17/2009
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03/17/2011
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Title:
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SEMICONDUCTOR DIE CONTAINING LATERAL EDGE SHAPES AND TEXTURES
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05/03/2011
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12562025
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09/17/2009
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01/14/2010
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Title:
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CHARGE BALANCE TECHNIQUES FOR POWER DEVICES
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09/21/2010
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12567578
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09/25/2009
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01/21/2010
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Title:
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POWER DEVICE WITH TRENCHES HAVING WIDER UPPER PORTION THAN LOWER PORTION
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07/03/2012
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12575641
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10/08/2009
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04/15/2010
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Title:
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SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE
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12/21/2010
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12576120
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10/08/2009
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02/04/2010
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Title:
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METHOD FOR FORMING LATERALLY EXTENDING DIELECTRIC LAYER IN A TRENCH-GATE FET
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07/20/2010
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12576290
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10/09/2009
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02/04/2010
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Title:
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PINCHED POLY FUSE
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03/20/2012
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12580560
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10/16/2009
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02/11/2010
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Title:
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ALUMINUM BUMP BONDING FOR FINE ALUMINUM WIRE
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08/03/2010
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12582487
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10/20/2009
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02/18/2010
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Title:
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METHOD AND STRUCTURE FOR FORMING A SHIELDED GATE FIELD EFFECT TRANSISTOR
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07/24/2012
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12606562
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10/27/2009
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04/28/2011
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Title:
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CAMERA SHUTTER CONTROL THROUGH A USB PORT OR AUDIO/VIDEO PORT
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08/14/2012
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12606582
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10/27/2009
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04/28/2011
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Title:
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METHOD OF DETECTING ACCESSORIES ON AN AUDIO JACK
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NONE
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12607294
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10/28/2009
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04/28/2011
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Title:
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LEADLESS SEMICONDUCTOR DEVICE TERMINAL
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NONE
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12607787
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10/28/2009
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Pub Dt:
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04/28/2011
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Title:
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WAFER LEVEL SEMICONDUCTOR DEVICE CONNECTOR
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NONE
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12614824
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11/09/2009
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Pub Dt:
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03/04/2010
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Title:
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SEMICONDUCTOR STRUCTURES FORMED ON SUBSTRATES AND METHODS OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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09/29/2015
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12616943
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11/12/2009
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Pub Dt:
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03/04/2010
| | | | |
Title:
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FLIP CHIP MLP WITH CONDUCTIVE INK
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04/02/2013
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12617142
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11/12/2009
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Pub Dt:
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05/12/2011
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Title:
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OPTOCOUPLER DEVICES
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NONE
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12625075
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11/24/2009
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04/01/2010
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Title:
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DICE BY GRIND FOR BACK SURFACE METALLIZED DIES
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03/06/2012
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12629232
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12/02/2009
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Pub Dt:
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06/02/2011
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Title:
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SEMICONDUCTOR DEVICES AND METHODS FOR MAKING THE SAME
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01/29/2013
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12629362
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12/02/2009
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06/02/2011
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Title:
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STEPPED-SOURCE LDMOS ARCHITECTURE
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NONE
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12633371
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12/08/2009
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Pub Dt:
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04/08/2010
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Title:
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ASSYMETRIC HETERO-DOPED HIGH-VOLTAGE MOSFET (AH2MOS)
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01/08/2013
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12636011
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12/11/2009
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04/08/2010
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Title:
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POWER SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
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01/25/2011
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12637496
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12/14/2009
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04/15/2010
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Title:
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CHIP MODULE FOR COMPLETE POWER TRAIN
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03/19/2013
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12644646
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12/22/2009
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Pub Dt:
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06/23/2011
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Title:
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SELECTIVELY ACTIVATED THREE-STATE CHARGE PUMP
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08/06/2013
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12644669
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12/22/2009
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06/23/2011
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Title:
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FAST RECOVERY VOLTAGE REGULATOR
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03/13/2012
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12644697
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12/22/2009
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06/23/2011
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Title:
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REDUCED CURRENT CHARGE PUMP
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11/06/2012
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12645075
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12/22/2009
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06/23/2011
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED COMPONENTS
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NONE
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12650144
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12/30/2009
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06/30/2011
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Title:
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TRANSCEIVER FOR WIRED SERIAL COMMUNICATION
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NONE
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12652491
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01/05/2010
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07/07/2011
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Title:
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SEMICONDUCTOR PACKAGES WITH EMBEDDED HEAT SINK
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02/14/2012
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12683058
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01/06/2010
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Pub Dt:
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07/07/2011
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Title:
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WAFER LEVEL STACK DIE PACKAGE
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07/02/2013
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12685592
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01/11/2010
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Pub Dt:
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05/06/2010
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Title:
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METHOD OF MANUFACTURE AND STRUCTURE FOR A TRENCH TRANSISTOR HAVING A HEAVY BODY REGION
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NONE
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12690179
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01/20/2010
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Pub Dt:
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05/13/2010
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Title:
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RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE
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Issue Dt:
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04/12/2011
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12698746
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02/02/2010
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Pub Dt:
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10/14/2010
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Title:
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TRENCH-GATE FIELD EFFECT TRANSISTOR WITH CHANNEL ENHANCEMENT REGION AND METHODS OF FORMING THE SAME
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04/12/2011
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12699600
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02/03/2010
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Pub Dt:
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06/03/2010
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Title:
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ETCHED LEADFRAME STRUCTURE
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11/20/2012
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12701773
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02/08/2010
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Pub Dt:
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08/11/2011
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE IN PRE-MOLDED CARRIER FRAME
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06/05/2012
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12705183
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02/12/2010
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Pub Dt:
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08/18/2011
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Title:
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MULTIPLE DETECTION CIRCUIT FOR ACCESSORY JACKS
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NONE
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12707323
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02/17/2010
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Pub Dt:
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08/18/2011
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Title:
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SEMICONDUCTOR DEVICES CONTAINING TRENCH MOSFETS WITH SUPERJUNCTIONS
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09/18/2012
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12713032
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02/25/2010
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Pub Dt:
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08/25/2011
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Title:
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CONTROL PIN POWERED ANALOG SWITCH
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Patent #:
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Issue Dt:
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11/13/2012
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12713039
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02/25/2010
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Publication #:
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Pub Dt:
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08/25/2011
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Title:
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FULLY FEATURED CONTROL PIN POWERED ANALOG SWITCH
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Patent #:
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Issue Dt:
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05/27/2014
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12714054
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02/26/2010
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Pub Dt:
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09/02/2010
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Title:
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PERIPHERAL DEVICE HOST CHARGING
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06/05/2012
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12717012
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03/03/2010
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Publication #:
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Pub Dt:
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06/24/2010
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Title:
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THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE
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03/08/2011
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12723128
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03/12/2010
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Pub Dt:
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07/01/2010
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Title:
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MULTIPHASE SYNCHRONOUS BUCK CONVERTER
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12/11/2012
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12755658
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04/07/2010
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Pub Dt:
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08/05/2010
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Title:
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DEVICES, METHODS, AND SYSTEMS WITH MOS-GATED TRENCH-TO-TRENCH LATERAL CURRENT FLOW
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10/25/2011
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12755966
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04/07/2010
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Pub Dt:
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10/21/2010
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Title:
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METHOD OF MANUFACTURING A TRENCH TRANSISTOR HAVING A HEAVY BODY REGION
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Patent #:
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10/02/2012
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12760286
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04/14/2010
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Pub Dt:
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10/20/2011
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Title:
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CHARGE PUMP SWITCH POWER DOWN PROTECTION
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Patent #:
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NONE
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12772764
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Filing Dt:
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05/03/2010
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Publication #:
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Pub Dt:
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10/21/2010
| | | | |
Title:
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SEMICONDUCTOR DIE PACKAGE INCLUDING HEAT SINKS
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Patent #:
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Issue Dt:
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11/20/2012
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12773552
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05/04/2010
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Publication #:
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Pub Dt:
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11/10/2011
| | | | |
Title:
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DIE BACKSIDE STANDOFF STRUCTURES FOR SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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06/12/2012
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12779844
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05/13/2010
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Pub Dt:
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09/02/2010
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Title:
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STRUCTURE WITH PN CLAMP REGIONS UNDER TRENCHES
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Patent #:
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Issue Dt:
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01/25/2011
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12787677
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05/26/2010
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Pub Dt:
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10/21/2010
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Title:
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SELF-ALIGNED COMPLEMENTARY LDMOS
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Patent #:
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Issue Dt:
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03/22/2011
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12788626
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05/27/2010
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Publication #:
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Pub Dt:
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09/16/2010
| | | | |
Title:
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INTEGRATED LOW LEAKAGE SCHOTTKY DIODE
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Patent #:
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Issue Dt:
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04/15/2014
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Application #:
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12790122
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05/28/2010
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Publication #:
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Pub Dt:
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12/01/2011
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Title:
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AUDIO AMPLIFIER PERFORMANCE WHILE MAINTAINING USB COMPLIANCE AND POWER DOWN PROTECTION
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Patent #:
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Issue Dt:
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09/27/2011
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Application #:
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12794936
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Filing Dt:
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06/07/2010
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Publication #:
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Pub Dt:
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09/23/2010
| | | | |
Title:
|
SEMICONDUCTOR POWER DEVICE HAVING A TOP-SIDE DRAIN USING A SINKER TRENCH
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12795157
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Filing Dt:
|
06/07/2010
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Publication #:
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Pub Dt:
|
09/30/2010
| | | | |
Title:
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BANDGAP ENGINEERED MOS-GATED POWER TRANSISTORS
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Patent #:
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Issue Dt:
|
10/25/2011
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Application #:
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12795368
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Filing Dt:
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06/07/2010
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Publication #:
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Pub Dt:
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04/07/2011
| | | | |
Title:
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PLANAR TMBS RECTIFIER
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Patent #:
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Issue Dt:
|
07/03/2012
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Application #:
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12814775
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Filing Dt:
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06/14/2010
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Publication #:
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Pub Dt:
|
12/16/2010
| | | | |
Title:
|
OVER-CURRENT PROTECTION CIRCUIT WITH FOLDBACK CAPABILITY
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Patent #:
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Issue Dt:
|
08/28/2012
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Application #:
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12815552
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Filing Dt:
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06/15/2010
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Publication #:
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Pub Dt:
|
12/16/2010
| | | | |
Title:
|
UNIVERSAL SERIAL BUS (USB) TO DIGITAL VIDEO
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Patent #:
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Issue Dt:
|
11/20/2012
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Application #:
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12815563
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Filing Dt:
|
06/15/2010
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Publication #:
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Pub Dt:
|
12/16/2010
| | | | |
Title:
|
UNIVERSAL SERIAL BUS (USB) TO DIGITAL VIDEO
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Patent #:
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|
Issue Dt:
|
04/30/2013
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Application #:
|
12819023
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Filing Dt:
|
06/18/2010
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Publication #:
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Pub Dt:
|
12/22/2011
| | | | |
Title:
|
TRENCH MOS BARRIER SCHOTTKY RECTIFIER WITH A PLANAR SURFACE USING CMP TECHNIQUES
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|
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Patent #:
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Issue Dt:
|
11/27/2012
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Application #:
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12819109
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Filing Dt:
|
06/18/2010
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Publication #:
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Pub Dt:
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12/22/2011
| | | | |
Title:
|
TRENCH MOS BARRIER SCHOTTKY RECTIFIER WITH A PLANAR SURFACE USING CMP TECHNIQUES
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Patent #:
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Issue Dt:
|
01/24/2012
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Application #:
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12821590
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Filing Dt:
|
06/23/2010
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Publication #:
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Pub Dt:
|
10/14/2010
| | | | |
Title:
|
METHOD OF FORMING A FET HAVING ULTRA-LOW ON-RESISTANCE AND LOW GATE CHARGE
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|
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Patent #:
|
|
Issue Dt:
|
06/07/2011
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Application #:
|
12822008
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Filing Dt:
|
06/23/2010
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Publication #:
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Pub Dt:
|
10/14/2010
| | | | |
Title:
|
FIELD EFFECT TRANSISTOR WITH SELF-ALIGNED SOURCE AND HEAVY BODY REGIONS AND METHOD OF MANUFACTURING SAME
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|
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Patent #:
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Issue Dt:
|
12/31/2013
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Application #:
|
12822471
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Filing Dt:
|
06/24/2010
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Publication #:
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Pub Dt:
|
12/29/2011
| | | | |
Title:
|
SHIELDED LEVEL SHIFT TRANSISTOR
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|
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Patent #:
|
|
Issue Dt:
|
11/23/2010
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Application #:
|
12822675
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Filing Dt:
|
06/24/2010
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Publication #:
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Pub Dt:
|
10/14/2010
| | | | |
Title:
|
PRE-MOLDED CLIP STRUCTURE
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|
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Patent #:
|
|
Issue Dt:
|
08/30/2011
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Application #:
|
12822932
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Filing Dt:
|
06/24/2010
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Publication #:
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|
Pub Dt:
|
10/14/2010
| | | | |
Title:
|
PRE-MOLDED CLIP STRUCTURE
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
12823037
|
Filing Dt:
|
06/24/2010
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Publication #:
|
|
Pub Dt:
|
10/14/2010
| | | | |
Title:
|
Method for Forming Shielded Gate Trench FET with Multiple Channels
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|
|
Patent #:
|
|
Issue Dt:
|
05/22/2012
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Application #:
|
12823411
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Filing Dt:
|
06/25/2010
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Publication #:
|
|
Pub Dt:
|
10/14/2010
| | | | |
Title:
|
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/11/2012
|
Application #:
|
12823805
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Filing Dt:
|
06/25/2010
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Publication #:
|
|
Pub Dt:
|
10/21/2010
| | | | |
Title:
|
SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES
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|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12828592
|
Filing Dt:
|
07/01/2010
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Publication #:
|
|
Pub Dt:
|
01/05/2012
| | | | |
Title:
|
DOUBLE MOLDED CHIP SCALE PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/13/2013
|
Application #:
|
12830074
|
Filing Dt:
|
07/02/2010
|
Publication #:
|
|
Pub Dt:
|
01/05/2012
| | | | |
Title:
|
BUCK-BOOST REGULATOR WITH CONVERTER BYPASS FUNCTION
|
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2011
|
Application #:
|
12830770
|
Filing Dt:
|
07/06/2010
|
Publication #:
|
|
Pub Dt:
|
12/09/2010
| | | | |
Title:
|
METHOD FOR FORMING ACTIVE AND GATE RUNNER TRENCHES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/23/2013
|
Application #:
|
12833781
|
Filing Dt:
|
07/09/2010
|
Publication #:
|
|
Pub Dt:
|
07/14/2011
| | | | |
Title:
|
DIE PACKAGE INCLUDING MULTIPLE DIES AND LEAD ORIENTATION
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2015
|
Application #:
|
12834472
|
Filing Dt:
|
07/12/2010
|
Publication #:
|
|
Pub Dt:
|
01/13/2011
| | | | |
Title:
|
NO POP SWITCH
|
|
|
Patent #:
|
|
Issue Dt:
|
06/12/2012
|
Application #:
|
12836664
|
Filing Dt:
|
07/15/2010
|
Publication #:
|
|
Pub Dt:
|
01/13/2011
| | | | |
Title:
|
DUAL SIDE COOLING INTEGRATED POWER DEVICE MODULE AND METHODS OF MANUFACTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/02/2012
|
Application #:
|
12838022
|
Filing Dt:
|
07/16/2010
|
Publication #:
|
|
Pub Dt:
|
11/04/2010
| | | | |
Title:
|
PACKAGE WITH MULTIPLE DIES
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12841774
|
Filing Dt:
|
07/22/2010
|
Publication #:
|
|
Pub Dt:
|
01/26/2012
| | | | |
Title:
|
Trench Superjunction MOSFET with Thin EPI Process
|
|
|
Patent #:
|
|
Issue Dt:
|
12/13/2011
|
Application #:
|
12845919
|
Filing Dt:
|
07/29/2010
|
Publication #:
|
|
Pub Dt:
|
12/23/2010
| | | | |
Title:
|
PN JUNCTION AND MOS CAPACITOR HYBRID RESURF TRANSISTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
06/05/2012
|
Application #:
|
12845999
|
Filing Dt:
|
07/29/2010
|
Publication #:
|
|
Pub Dt:
|
07/07/2011
| | | | |
Title:
|
SYNCHRONOUS BUCK CONVERTER USING SHIELDED GATE FIELD EFFECT TRANSISTORS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12846097
|
Filing Dt:
|
07/29/2010
|
Publication #:
|
|
Pub Dt:
|
02/02/2012
| | | | |
Title:
|
MOTOR ROTOR AND MOTOR HAVING THE MOTOR ROTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2011
|
Application #:
|
12849535
|
Filing Dt:
|
08/03/2010
|
Publication #:
|
|
Pub Dt:
|
12/16/2010
| | | | |
Title:
|
LATERAL DRAIN MOSFET WITH IMPROVED CLAMPING VOLTAGE CONTROL
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2014
|
Application #:
|
12849742
|
Filing Dt:
|
08/03/2010
|
Publication #:
|
|
Pub Dt:
|
02/10/2011
| | | | |
Title:
|
MICROMACHINED INERTIAL SENSOR DEVICES
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|
|
Patent #:
|
|
Issue Dt:
|
09/18/2012
|
Application #:
|
12854391
|
Filing Dt:
|
08/11/2010
|
Publication #:
|
|
Pub Dt:
|
02/16/2012
| | | | |
Title:
|
RESURF DEVICE INCLUDING INCREASED BREAKDOWN VOLTAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2012
|
Application #:
|
12855904
|
Filing Dt:
|
08/13/2010
|
Publication #:
|
|
Pub Dt:
|
12/02/2010
| | | | |
Title:
|
METHOD FOR CONNECTING A DIE ATTACH PAD TO A LEAD FRAME AND PRODUCT THEREOF
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|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12860248
|
Filing Dt:
|
08/20/2010
|
Publication #:
|
|
Pub Dt:
|
12/09/2010
| | | | |
Title:
|
MULTI-CHIP SEMICONDUCTOR PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
09/18/2012
|
Application #:
|
12862163
|
Filing Dt:
|
08/24/2010
|
Publication #:
|
|
Pub Dt:
|
12/16/2010
| | | | |
Title:
|
HIGH SPEED, LOW POWER CONSUMPTION, ISOLATED ANALOG CMOS UNIT
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|
|
Patent #:
|
|
Issue Dt:
|
07/09/2013
|
Application #:
|
12869416
|
Filing Dt:
|
08/26/2010
|
Publication #:
|
|
Pub Dt:
|
03/01/2012
| | | | |
Title:
|
METHOD AND APPARATUS FOR BRIDGELESS POWER FACTOR CORRECTION
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|
|
Patent #:
|
|
Issue Dt:
|
03/11/2014
|
Application #:
|
12870600
|
Filing Dt:
|
08/27/2010
|
Publication #:
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|
Pub Dt:
|
12/23/2010
| | | | |
Title:
|
STRUCTURE RELATED TO A THICK BOTTOM DIELECTRIC (TBD) FOR TRENCH-GATE DEVICES
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|
|
Patent #:
|
|
Issue Dt:
|
08/21/2012
|
Application #:
|
12874800
|
Filing Dt:
|
09/02/2010
|
Publication #:
|
|
Pub Dt:
|
03/08/2012
| | | | |
Title:
|
INTEGRATED CIRCUIT SINGLE ENDED-TO-DIFFERENTIAL AMPLIFIER
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|
|
Patent #:
|
|
Issue Dt:
|
09/17/2013
|
Application #:
|
12874832
|
Filing Dt:
|
09/02/2010
|
Publication #:
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|
Pub Dt:
|
03/08/2012
| | | | |
Title:
|
HIGH-IMPEDANCE NETWORK
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|
|
Patent #:
|
|
Issue Dt:
|
07/22/2014
|
Application #:
|
12878429
|
Filing Dt:
|
09/09/2010
|
Publication #:
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|
Pub Dt:
|
01/06/2011
| | | | |
Title:
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Power Semiconductor Devices Having Termination Structures
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|
|
Patent #:
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|
Issue Dt:
|
01/07/2014
|
Application #:
|
12878779
|
Filing Dt:
|
09/09/2010
|
Publication #:
|
|
Pub Dt:
|
07/07/2011
| | | | |
Title:
|
NO POP SWITCH
|
|
|
Patent #:
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|
Issue Dt:
|
02/21/2012
|
Application #:
|
12882353
|
Filing Dt:
|
09/15/2010
|
Publication #:
|
|
Pub Dt:
|
01/06/2011
| | | | |
Title:
|
FLIP CHIP MLP WITH FOLDED HEAT SINK
|
|
|
Patent #:
|
|
Issue Dt:
|
06/05/2012
|
Application #:
|
12883044
|
Filing Dt:
|
09/15/2010
|
Publication #:
|
|
Pub Dt:
|
03/10/2011
| | | | |
Title:
|
HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAPABILITY AND METHODS OF MANUFACTURING THE SAME
|
|