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Total properties:
22
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Patent #:
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Issue Dt:
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02/22/2005
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Application #:
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09919788
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Filing Dt:
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07/31/2001
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Publication #:
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Pub Dt:
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02/21/2002
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Title:
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PLATING METHOD AND APPARATUS THAT CREATES A DIFFERENTIAL BETWEEN ADDITIVE DISPOSED ON A TOP SURFACE AND A CAVITY SURFACE OF A WORKPIECE USING AN INDIRECT EXTERNAL INFLUENCE
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Patent #:
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Issue Dt:
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02/08/2005
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Application #:
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10265460
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Filing Dt:
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10/03/2002
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Publication #:
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Pub Dt:
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02/13/2003
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Title:
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METHOD AND APPARATUS FOR FULL SURFACE ELECTROTREATING OF A WAFER
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Patent #:
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Issue Dt:
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11/09/2004
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Application #:
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10282976
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Filing Dt:
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10/28/2002
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Publication #:
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Pub Dt:
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05/01/2003
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Title:
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METHOD AND STRUCTURE FOR THRU-MASK CONTACT ELECTRODEPOSITION
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Patent #:
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Issue Dt:
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09/13/2005
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Application #:
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10321150
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Filing Dt:
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12/17/2002
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Publication #:
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Pub Dt:
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08/14/2003
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Title:
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In-situ endpoint detection for non-transparent polishing member
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Patent #:
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Issue Dt:
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02/22/2005
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Application #:
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10346425
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Filing Dt:
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01/17/2003
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Publication #:
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Pub Dt:
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02/05/2004
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Title:
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ADVANCED CHEMICAL MECHANICAL POLISHING SYSTEM WITH SMART ENDPOINT DETECTION
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Patent #:
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Issue Dt:
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06/21/2005
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Application #:
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10614311
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Filing Dt:
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07/07/2003
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Publication #:
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Pub Dt:
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05/20/2004
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Title:
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ADVANCED BI-DIRECTIONAL LINEAR POLISHING SYSTEM AND METHOD
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Patent #:
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Issue Dt:
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07/31/2007
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Application #:
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10637731
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Filing Dt:
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08/08/2003
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Publication #:
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Pub Dt:
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02/10/2005
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Title:
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METHOD AND SYSTEM FOR OPTICALLY ENHANCED METAL PLANARIZATION
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Patent #:
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Issue Dt:
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07/31/2007
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Application #:
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10638751
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Filing Dt:
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08/11/2003
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Publication #:
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Pub Dt:
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10/14/2004
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Title:
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METHOD AND APPARATUS FOR ELIMINATING DEFECTS AND IMPROVING UNIFORMITY IN ELECTROCHEMICALLY PROCESSED CONDUCTIVE LAYERS
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Patent #:
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Issue Dt:
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01/08/2008
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Application #:
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10654542
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Filing Dt:
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09/02/2003
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Publication #:
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Pub Dt:
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06/17/2004
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Title:
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CONSTANT LOW FORCE WAFER CARRIER FOR ELECTROCHEMICAL MECHANICAL PROCESSING AND CHEMICAL MECHANICAL POLISHING
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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10692952
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Filing Dt:
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10/24/2003
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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PROCESS AND SYSTEM FOR ELIMINATING GAS BUBBLES DURING ELECTROCHEMICAL PROCESSING
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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10692953
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Filing Dt:
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10/24/2003
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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Process and apparatus for air bubble removal during electrochemical processing
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10698872
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Filing Dt:
|
10/31/2003
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Publication #:
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Pub Dt:
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07/22/2004
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Title:
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Continuous bleed-and-feed process and equipment
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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10698878
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Filing Dt:
|
10/31/2003
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Publication #:
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Pub Dt:
|
05/05/2005
| | | | |
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Title:
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Methods for depositing high yield and low defect density conductive films in damascene structures
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Patent #:
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Issue Dt:
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04/17/2007
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Application #:
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10703293
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Filing Dt:
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11/07/2003
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Publication #:
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Pub Dt:
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07/08/2004
| | | | |
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Title:
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INTEGRATED CIRCUIT INTERCONNECT FABRICATION SYSTEMS
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10705360
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Filing Dt:
|
11/10/2003
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Publication #:
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Pub Dt:
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09/02/2004
| | | | |
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Title:
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Electrochemical mechanical processing using low temperature process environment
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Patent #:
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Issue Dt:
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06/20/2006
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Application #:
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10719909
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Filing Dt:
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11/21/2003
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Publication #:
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Pub Dt:
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05/26/2005
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Title:
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METHOD AND APPARATUS FOR LOCALIZED MATERIAL REMOVAL BY ELECTROCHEMICAL POLISHING
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Patent #:
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Issue Dt:
|
03/27/2007
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Application #:
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10723045
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Filing Dt:
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11/26/2003
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Publication #:
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Pub Dt:
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01/13/2005
| | | | |
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Title:
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ELECTRODE ASSEMBLY FOR ELECTROCHEMICAL PROCESSING OF WORKPIECE
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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10769605
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Filing Dt:
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01/30/2004
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Publication #:
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Pub Dt:
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12/30/2004
| | | | |
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Title:
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METHOD OF ELECTROPLATING COPPER LAYERS WITH FLAT TOPOGRAPHY
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Patent #:
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|
Issue Dt:
|
11/28/2006
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Application #:
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10816340
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Filing Dt:
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03/31/2004
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Publication #:
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Pub Dt:
|
12/30/2004
| | | | |
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Title:
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MEANS TO IMPROVE CENTER TO EDGE UNIFORMITY OF ELECTROCHEMICAL MECHANICAL PROCESSING OF WORKPIECE SURFACE
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|
|
|
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
|
10818976
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Filing Dt:
|
04/06/2004
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|
Publication #:
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|
Pub Dt:
|
12/23/2004
| | | | |
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Title:
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Method of reducing post-CMP defectivity
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|
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Patent #:
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Issue Dt:
|
09/23/2008
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Application #:
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10822424
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Filing Dt:
|
04/12/2004
|
|
Publication #:
|
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Pub Dt:
|
06/23/2005
| | | | |
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Title:
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SYSTEM FOR ELECTROPOLISHING AND ELECTROCHEMICAL MECHANICAL POLISHING
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2007
|
Application #:
|
10826219
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Filing Dt:
|
04/16/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2004
| | | | |
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Title:
|
DEVICE PROVIDING ELECTRICAL CONTACT TO THE SURFACE OF A SEMICONDUCTOR WORKPIECE DURING PROCESSING
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|
