Patent Assignment Details
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| Reel/Frame: | 054991/0376 | |
| Pages: | 7 |
| | Recorded: | 01/21/2021 | | |
| Attorney Dkt #: | 04017.0293U1 (A 5187 US) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/29/2022
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Application #:
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16947477
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Filing Dt:
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08/03/2020
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Publication #:
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Pub Dt:
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02/11/2021
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Title:
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Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
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Assignee
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| NO. 5000, JIN DU ROAD |
| XINZHUANG INDUSTRY PARK, MINHANG DISTRICT |
| SHANGHAI, CHINA 201108 |
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Correspondence name and address
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SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM
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50 GLENLAKE PARKWAY, SUITE 340
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ATLANTA, GA 30328
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