Patent Assignment Details
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| Reel/Frame: | 012202/0378 | |
| Pages: | 4 |
| | Recorded: | 09/10/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09950387
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Filing Dt:
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09/10/2001
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Publication #:
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Pub Dt:
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03/13/2003
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Title:
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High-density inter-die interconnect structure
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Assignee
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| 14645 N.W. 77TH AVE., SUITE 105 |
| MIAMI LAKES, FLORIDA 33014 |
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Correspondence name and address
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HOLLAND & KNIGHT LLP
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JOHN L. DEANGELIS, JR., ESQ.
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1499 S. HARBOR CITY BLVD., SUITE 201
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MELBOURNE, FL 32901
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06/16/2024 07:49 AM
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