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Patent Assignment Details
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Reel/Frame:019643/0378   Pages: 6
Recorded: 07/16/2007
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/21/2014
Application #:
11879239
Filing Dt:
07/16/2007
Publication #:
Pub Dt:
06/05/2008
Title:
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHODS FOR FORMING SAME, IN PARTICULAR FOR MEMS DEVICES
Assignors
1
Exec Dt:
07/11/2007
2
Exec Dt:
07/11/2007
3
Exec Dt:
07/11/2007
4
Exec Dt:
07/11/2007
5
Exec Dt:
07/11/2007
Assignees
1
VIA C. OLIVETTI, 2
AGRATE BRIANAZA (MI) I-20041, ITALY
2
INDUSTRIAL CENTER, INDUSTRIES ROAD
KIRKOP ZRQ 10, MALTA
Correspondence name and address
GRAYBEAL JACKSON HALEY LLP
PAUL F. RUSYN
155 - 108TH AVENUE N.E., SUITE 350
BELLEVUE, WASHINGTON 98004-5673

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