Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 065892/0380 | |
| Pages: | 5 |
| | Recorded: | 12/18/2023 | | |
Attorney Dkt #: | DF225077US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18328800
|
Filing Dt:
|
06/05/2023
|
Publication #:
|
|
Pub Dt:
|
01/11/2024
| | | | |
Title:
|
ROUTING STRUCTURE AND METHOD OF WAFER SUBSTRATE WITH STANDARD INTEGRATION ZONE FOR INTEGRATION ON-WAFER
|
|
Assignee
|
|
|
ZHEJIANG LAB KECHUANG AVENUE, ZHONGTAI SUB-DISTRICT, YUHANG DISTRICT, HANGZHOU CITY, ZHEJIANG PROVINCE, 311121, P.R. CHINA |
HANGZHOU, CHINA |
|
Correspondence name and address
|
|
MICHAEL WIERSCH
|
|
2401 RIPPEY RD
|
|
LOOMIS, CA 95650
|
Search Results as of:
05/24/2024 10:34 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|