Patent Assignment Details
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| Reel/Frame: | 036972/0382 | |
| Pages: | 8 |
| | Recorded: | 11/05/2015 | | |
| Attorney Dkt #: | 092970-003920US-0962810 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/05/2018
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Application #:
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14933694
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Filing Dt:
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11/05/2015
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Publication #:
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Pub Dt:
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05/12/2016
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Title:
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SEMICONDUCTOR BONDING WITH COMPLIANT RESIN AND UTILIZING HYDROGEN IMPLANTATION FOR TRANSFER-WAFER REMOVAL
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Assignee
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| 5600 EUBANK BOULEVARD NE |
| SUITE 200 |
| ALBUQUERQUE, NEW MEXICO 87111 |
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Correspondence name and address
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KILPATRICK TOWNSEND & STOCKTON LLP
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TWO EMBARCADERO CENTER
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EIGHTH FLOOR
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SAN FRANCISCO, CA 94111-3834
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