Patent Assignment Details
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| Reel/Frame: | 045096/0385 | |
| Pages: | 4 |
| | Recorded: | 01/19/2018 | | |
| Attorney Dkt #: | LFD-0012-IN |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/31/2019
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Application #:
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15746100
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Filing Dt:
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01/19/2018
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Publication #:
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Pub Dt:
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07/26/2018
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Title:
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PACKAGE SUBSTRATE COMPRISING SIDE PADS ON EDGE, CHIP STACK, SEMICONDUCTOR PACKAGE, AND MEMORY MODULE COMPRISING SAME
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Assignees
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| (PARKVIEW, JEONGJA-DONG) #603-205, 248, JEONGJAIL-RO, BUNDANG-GU |
| SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 13554 |
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| (BELLAGIO, DUJEONG-DONG) #402-HO, DUJEONGSANGGA 13-GIL, SEOBUK-GU |
| CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31106 |
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| (SINBANPO APT., JAMWON-DONG) #216-206, 171, SINBANPO-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06509 |
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| (HYUNDAI APT., PUNGDEOKCHEON-DONG) #101-1405, 18, SUJI-RO 342BEON-GIL, SUJI-GU |
| YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16838 |
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Correspondence name and address
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KILE PARK REED & HOUTTEMAN PLLC
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1101 30TH STREET, NW
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SUITE 500
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WASHINGTON, DC 20007
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