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Patent Assignment Details
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Reel/Frame:008499/0387   Pages: 3
Recorded: 05/12/1997
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/22/1999
Application #:
08777927
Filing Dt:
12/23/1996
Title:
SEMICONDUCTOR CHIP SCALE PACKAGE AND METHOD OF PRODUCING SUCH
Assignor
1
Exec Dt:
04/11/1997
Assignees
1
280-8, SUNGSU 2 GA DUNGDONG-KU
SEOUL, KOREA, REPUBLIC OF 133-1
2
1900 S. PRICE ROAD
CHANDLER, ARIZONA 85248
Correspondence name and address
SKJERVEN, MORRILL, MACPHERSON, ET AL
THOMAS S. MACDONALD
25 METRO DRIVE, SUITE 700
SAN JOSE, CA 95110

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