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Reel/Frame:023119/0387   Pages: 11
Recorded: 08/20/2009
Attorney Dkt #:085027-0010
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 80
1
Patent #:
6103552
Issue Dt:
08/15/2000
Application #:
09131429
Filing Dt:
08/10/1998
Title:
WAFER SCALE PACKAGING SCHEME
2
Patent #:
6356958
Issue Dt:
03/12/2002
Application #:
09246303
Filing Dt:
02/08/1999
Title:
INTERGRATED CIRCUIT HAS COMMON FUNCTION KNOWS GOOD INTERGRATED CIRCUIT DIE WITH MULTIPLE SELECTABLE FUNCTIONS
3
Patent #:
6159773
Issue Dt:
12/12/2000
Application #:
09249252
Filing Dt:
02/12/1999
Title:
STRAIN RELEASE CONTACT SYSTEM FOR INTEGRATED CIRCUITS
4
Patent #:
6383916
Issue Dt:
05/07/2002
Application #:
09251183
Filing Dt:
02/17/1999
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
5
Patent #:
6180426
Issue Dt:
01/30/2001
Application #:
09258911
Filing Dt:
03/01/1999
Title:
HIGH PERFORMANCE SUB-SYSTEM DESIGN AND ASSEMBLY
6
Patent #:
6555398
Issue Dt:
04/29/2003
Application #:
09422174
Filing Dt:
10/22/1999
Title:
SOFTWARE PROGRAMMABLE MULTIPLE FUNCTION INTEGRATED CIRCUIT MODULE
7
Patent #:
6486563
Issue Dt:
11/26/2002
Application #:
09619017
Filing Dt:
07/19/2000
Title:
WAFER SCALE PACKAGING SCHEME
8
Patent #:
6351035
Issue Dt:
02/26/2002
Application #:
09727869
Filing Dt:
12/04/2000
Publication #:
US20010000152
Pub Dt:
04/05/2001
Title:
Strain release contact system for integrated circuits
9
Patent #:
6303996
Issue Dt:
10/16/2001
Application #:
09729152
Filing Dt:
12/04/2000
Publication #:
US20010000013
Pub Dt:
03/15/2001
Title:
High performance sub-system design and assembly
10
Patent #:
6657310
Issue Dt:
12/02/2003
Application #:
09972639
Filing Dt:
10/09/2001
Publication #:
US20020048930
Pub Dt:
04/25/2002
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
11
Patent #:
6620728
Issue Dt:
09/16/2003
Application #:
10058259
Filing Dt:
01/29/2002
Publication #:
US20020068441
Pub Dt:
06/06/2002
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
12
Patent #:
7360005
Issue Dt:
04/15/2008
Application #:
10385953
Filing Dt:
03/11/2003
Publication #:
US20030172364
Pub Dt:
09/11/2003
Title:
SOFTWARE PROGRAMMABLE MULTIPLE FUNCTION INTEGRATED CIRCUIT MODULE
13
Patent #:
6965165
Issue Dt:
11/15/2005
Application #:
10389543
Filing Dt:
03/14/2003
Publication #:
US20030170934
Pub Dt:
09/11/2003
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
14
Patent #:
7294870
Issue Dt:
11/13/2007
Application #:
11121477
Filing Dt:
05/04/2005
Publication #:
US20050200023
Pub Dt:
09/15/2005
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
15
Patent #:
7329954
Issue Dt:
02/12/2008
Application #:
11130917
Filing Dt:
05/17/2005
Publication #:
US20050245067
Pub Dt:
11/03/2005
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
16
Patent #:
7372155
Issue Dt:
05/13/2008
Application #:
11131481
Filing Dt:
05/18/2005
Publication #:
US20050208757
Pub Dt:
09/22/2005
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
17
Patent #:
7384864
Issue Dt:
06/10/2008
Application #:
11145468
Filing Dt:
06/03/2005
Publication #:
US20050260849
Pub Dt:
11/24/2005
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
18
Patent #:
7422976
Issue Dt:
09/09/2008
Application #:
11149092
Filing Dt:
06/09/2005
Publication #:
US20050266612
Pub Dt:
12/01/2005
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
19
Patent #:
7294871
Issue Dt:
11/13/2007
Application #:
11230004
Filing Dt:
09/19/2005
Publication #:
US20060012049
Pub Dt:
01/19/2006
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
20
Patent #:
7372085
Issue Dt:
05/13/2008
Application #:
11230101
Filing Dt:
09/19/2005
Publication #:
US20060043594
Pub Dt:
03/02/2006
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
21
Patent #:
7368376
Issue Dt:
05/06/2008
Application #:
11230102
Filing Dt:
09/19/2005
Publication #:
US20060051955
Pub Dt:
03/09/2006
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
22
Patent #:
7385291
Issue Dt:
06/10/2008
Application #:
11829105
Filing Dt:
07/27/2007
Publication #:
US20070262458
Pub Dt:
11/15/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
23
Patent #:
NONE
Issue Dt:
Application #:
11829106
Filing Dt:
07/27/2007
Publication #:
US20070262459
Pub Dt:
11/15/2007
Title:
Top layers of metal for high performance IC's
24
Patent #:
NONE
Issue Dt:
Application #:
11829107
Filing Dt:
07/27/2007
Publication #:
US20070262460
Pub Dt:
11/15/2007
Title:
Top layers of metal for high performance IC's
25
Patent #:
7358610
Issue Dt:
04/15/2008
Application #:
11829108
Filing Dt:
07/27/2007
Publication #:
US20070262455
Pub Dt:
11/15/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
26
Patent #:
7999384
Issue Dt:
08/16/2011
Application #:
11829109
Filing Dt:
07/27/2007
Publication #:
US20070262456
Pub Dt:
11/15/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
27
Patent #:
8531038
Issue Dt:
09/10/2013
Application #:
11829110
Filing Dt:
07/27/2007
Publication #:
US20070262457
Pub Dt:
11/15/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
28
Patent #:
NONE
Issue Dt:
Application #:
11833225
Filing Dt:
08/02/2007
Publication #:
US20070267714
Pub Dt:
11/22/2007
Title:
Top layers of metal for high performance IC's
29
Patent #:
NONE
Issue Dt:
Application #:
11839550
Filing Dt:
08/16/2007
Publication #:
US20070273032
Pub Dt:
11/29/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
30
Patent #:
NONE
Issue Dt:
Application #:
11839551
Filing Dt:
08/16/2007
Publication #:
US20070273033
Pub Dt:
11/29/2007
Title:
Top layers of metal for high performance IC's
31
Patent #:
NONE
Issue Dt:
Application #:
11839552
Filing Dt:
08/16/2007
Publication #:
US20070273034
Pub Dt:
11/29/2007
Title:
Top layers of metal for high performance IC's
32
Patent #:
7884479
Issue Dt:
02/08/2011
Application #:
11839554
Filing Dt:
08/16/2007
Publication #:
US20070273035
Pub Dt:
11/29/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
33
Patent #:
NONE
Issue Dt:
Application #:
11839556
Filing Dt:
08/16/2007
Publication #:
US20070273036
Pub Dt:
11/29/2007
Title:
Top layers of metal for high performance IC's
34
Patent #:
NONE
Issue Dt:
Application #:
11839557
Filing Dt:
08/16/2007
Publication #:
US20070273037
Pub Dt:
11/29/2007
Title:
Top layers of metal for high performance IC's
35
Patent #:
7442969
Issue Dt:
10/28/2008
Application #:
11839558
Filing Dt:
08/16/2007
Publication #:
US20070273038
Pub Dt:
11/29/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
36
Patent #:
7397135
Issue Dt:
07/08/2008
Application #:
11839559
Filing Dt:
08/16/2007
Publication #:
US20070273039
Pub Dt:
11/29/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
37
Patent #:
NONE
Issue Dt:
Application #:
11839560
Filing Dt:
08/16/2007
Publication #:
US20070273040
Pub Dt:
11/29/2007
Title:
Top layers of metal for high performance IC's
38
Patent #:
NONE
Issue Dt:
Application #:
11839561
Filing Dt:
08/16/2007
Publication #:
US20070273041
Pub Dt:
11/29/2007
Title:
Top layers of metal for high performance IC's
39
Patent #:
NONE
Issue Dt:
Application #:
11840230
Filing Dt:
08/17/2007
Publication #:
US20070278688
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
40
Patent #:
NONE
Issue Dt:
Application #:
11840231
Filing Dt:
08/17/2007
Publication #:
US20070278684
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
41
Patent #:
NONE
Issue Dt:
Application #:
11840232
Filing Dt:
08/17/2007
Publication #:
US20070278685
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
42
Patent #:
NONE
Issue Dt:
Application #:
11840233
Filing Dt:
08/17/2007
Publication #:
US20070278689
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
43
Patent #:
NONE
Issue Dt:
Application #:
11840234
Filing Dt:
08/17/2007
Publication #:
US20070278690
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
44
Patent #:
NONE
Issue Dt:
Application #:
11840235
Filing Dt:
08/17/2007
Publication #:
US20070281467
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
45
Patent #:
NONE
Issue Dt:
Application #:
11840236
Filing Dt:
08/17/2007
Publication #:
US20070281468
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
46
Patent #:
NONE
Issue Dt:
Application #:
11840237
Filing Dt:
08/17/2007
Publication #:
US20070281463
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
47
Patent #:
NONE
Issue Dt:
Application #:
11840238
Filing Dt:
08/17/2007
Publication #:
US20070278686
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
48
Patent #:
7465975
Issue Dt:
12/16/2008
Application #:
11840239
Filing Dt:
08/17/2007
Publication #:
US20070278687
Pub Dt:
12/06/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
49
Patent #:
NONE
Issue Dt:
Application #:
11840241
Filing Dt:
08/17/2007
Publication #:
US20070281458
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
50
Patent #:
7425764
Issue Dt:
09/16/2008
Application #:
11840242
Filing Dt:
08/17/2007
Publication #:
US20070278679
Pub Dt:
12/06/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
51
Patent #:
NONE
Issue Dt:
Application #:
11840243
Filing Dt:
08/17/2007
Publication #:
US20070278691
Pub Dt:
12/06/2007
Title:
Top layers of metal for high performance IC's
52
Patent #:
8471384
Issue Dt:
06/25/2013
Application #:
11842153
Filing Dt:
08/21/2007
Publication #:
US20070284750
Pub Dt:
12/13/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
53
Patent #:
NONE
Issue Dt:
Application #:
11842158
Filing Dt:
08/21/2007
Publication #:
US20070284751
Pub Dt:
12/13/2007
Title:
Top layers of metal for high performance IC's
54
Patent #:
NONE
Issue Dt:
Application #:
11842159
Filing Dt:
08/21/2007
Publication #:
US20070284753
Pub Dt:
12/13/2007
Title:
Top layers of metal for high performance IC's
55
Patent #:
7482693
Issue Dt:
01/27/2009
Application #:
11842160
Filing Dt:
08/21/2007
Publication #:
US20070284739
Pub Dt:
12/13/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
56
Patent #:
NONE
Issue Dt:
Application #:
11842161
Filing Dt:
08/21/2007
Publication #:
US20070284752
Pub Dt:
12/13/2007
Title:
Top layers of metal for high performance IC's
57
Patent #:
NONE
Issue Dt:
Application #:
11845109
Filing Dt:
08/27/2007
Publication #:
US20070290348
Pub Dt:
12/20/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
58
Patent #:
NONE
Issue Dt:
Application #:
11845110
Filing Dt:
08/27/2007
Publication #:
US20070290349
Pub Dt:
12/20/2007
Title:
Top layers of metal for high performance IC's
59
Patent #:
NONE
Issue Dt:
Application #:
11845111
Filing Dt:
08/27/2007
Publication #:
US20070290350
Pub Dt:
12/20/2007
Title:
Top layers of metal for high performance IC's
60
Patent #:
NONE
Issue Dt:
Application #:
11845113
Filing Dt:
08/27/2007
Publication #:
US20070290351
Pub Dt:
12/20/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
61
Patent #:
7385292
Issue Dt:
06/10/2008
Application #:
11845115
Filing Dt:
08/27/2007
Publication #:
US20070290352
Pub Dt:
12/20/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
62
Patent #:
7388292
Issue Dt:
06/17/2008
Application #:
11845116
Filing Dt:
08/27/2007
Publication #:
US20070290353
Pub Dt:
12/20/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
63
Patent #:
NONE
Issue Dt:
Application #:
11845122
Filing Dt:
08/27/2007
Publication #:
US20070290354
Pub Dt:
12/20/2007
Title:
Top layers of metal for high performance IC's
64
Patent #:
8415800
Issue Dt:
04/09/2013
Application #:
11845123
Filing Dt:
08/27/2007
Publication #:
US20070290368
Pub Dt:
12/20/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
65
Patent #:
NONE
Issue Dt:
Application #:
11845759
Filing Dt:
08/27/2007
Publication #:
US20070290355
Pub Dt:
12/20/2007
Title:
Top layers of metal for high performance IC's
66
Patent #:
NONE
Issue Dt:
Application #:
11845764
Filing Dt:
08/27/2007
Publication #:
US20070290356
Pub Dt:
12/20/2007
Title:
Top layers of metal for high performance IC's
67
Patent #:
7382058
Issue Dt:
06/03/2008
Application #:
11845766
Filing Dt:
08/27/2007
Publication #:
US20070290357
Pub Dt:
12/20/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
68
Patent #:
NONE
Issue Dt:
Application #:
11845771
Filing Dt:
08/27/2007
Publication #:
US20070290358
Pub Dt:
12/20/2007
Title:
Top layers of metal for high performance IC's
69
Patent #:
NONE
Issue Dt:
Application #:
11845773
Filing Dt:
08/27/2007
Publication #:
US20070293036
Pub Dt:
12/20/2007
Title:
Top layers of metal for high performance IC's
70
Patent #:
7396756
Issue Dt:
07/08/2008
Application #:
11845775
Filing Dt:
08/27/2007
Publication #:
US20070293037
Pub Dt:
12/20/2007
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
71
Patent #:
NONE
Issue Dt:
Application #:
11893659
Filing Dt:
08/17/2007
Publication #:
US20070288880
Pub Dt:
12/13/2007
Title:
Top layers of metal for high performance IC's
72
Patent #:
NONE
Issue Dt:
Application #:
11930185
Filing Dt:
10/31/2007
Publication #:
US20080083987
Pub Dt:
04/10/2008
Title:
Top layers of metal for high performance IC's
73
Patent #:
NONE
Issue Dt:
Application #:
11930187
Filing Dt:
10/31/2007
Publication #:
US20080048329
Pub Dt:
02/28/2008
Title:
Top layers of metal for high performance IC's
74
Patent #:
NONE
Issue Dt:
Application #:
11930189
Filing Dt:
10/31/2007
Publication #:
US20080083988
Pub Dt:
04/10/2008
Title:
Top layers of metal for high performance IC's
75
Patent #:
7456100
Issue Dt:
11/25/2008
Application #:
11930191
Filing Dt:
10/31/2007
Publication #:
US20080050913
Pub Dt:
02/28/2008
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
76
Patent #:
8107311
Issue Dt:
01/31/2012
Application #:
12034668
Filing Dt:
02/21/2008
Publication #:
US20080143387
Pub Dt:
06/19/2008
Title:
SOFTWARE PROGRAMMABLE MULTIPLE FUNCTION INTEGRATED CIRCUIT MODULE
77
Patent #:
NONE
Issue Dt:
Application #:
12036306
Filing Dt:
02/25/2008
Publication #:
US20080142980
Pub Dt:
06/19/2008
Title:
Top layers of metal for high performance IC's
78
Patent #:
8022545
Issue Dt:
09/20/2011
Application #:
12036308
Filing Dt:
02/25/2008
Publication #:
US20080142981
Pub Dt:
06/19/2008
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
79
Patent #:
NONE
Issue Dt:
Application #:
12036309
Filing Dt:
02/25/2008
Publication #:
US20080146020
Pub Dt:
06/19/2008
Title:
Top layers of metal for high performance IC's
80
Patent #:
7863654
Issue Dt:
01/04/2011
Application #:
12203154
Filing Dt:
09/03/2008
Publication #:
US20090045516
Pub Dt:
02/19/2009
Title:
TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S
Assignor
1
LIN, MOU-SHIUNG, DR.
Exec Dt:
07/28/2009
Assignee
1
MEGICA CORPORATION
47 PARK 2ND ROAD
SUITE 301, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN ROC
Correspondence name and address
MCDERMOTT WILL & EMERY, LLP
11682 EL CAMINO REAL
SUITE 400
SAN DIEGO, CA 92130

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