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Patent Assignment Details
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Reel/Frame:015171/0388   Pages: 2
Recorded: 03/31/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/18/2007
Application #:
10812889
Filing Dt:
03/31/2004
Publication #:
Pub Dt:
10/13/2005
Title:
DIELECTRIC COMPOSITION FOR FORMING DIELECTRIC LAYER FOR USE IN CIRCUITIZED SUBSTRATES
Assignors
1
Exec Dt:
03/30/2004
2
Exec Dt:
03/30/2004
Assignee
1
1701 NORTH STREET
ENDICOTT, NEW YORK 13760
Correspondence name and address
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
LAWRENCE R. FRALEY
IP LAW COUNSEL
1701 NORTH STREET
ENDICOTT, NY 13760

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