Patent Assignment Details
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Reel/Frame: | 016897/0388 | |
| Pages: | 10 |
| | Recorded: | 10/17/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/02/2008
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Application #:
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11129105
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Filing Dt:
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05/13/2005
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Publication #:
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Pub Dt:
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03/02/2006
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Title:
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LOW TEMPERATURE METHODS OF FORMING BACK SIDE REDISTRIBUTION LAYERS IN ASSOCIATION WITH THROUGH WAFER INTERCONNECTS, SEMICONDUCTOR DEVICES INCLUDING SAME, AND ASSEMBLIES
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Assignee
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8000 SOUTH FEDERAL WAY |
BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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TRASKBRITT
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P.O. BOX 2550
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SALT LAKE CITY, UT 84110
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