Patent Assignment Details
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| Reel/Frame: | 051594/0388 | |
| Pages: | 6 |
| | Recorded: | 01/23/2020 | | |
| Attorney Dkt #: | 251367-2800 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/24/2022
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Application #:
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16661219
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Filing Dt:
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10/23/2019
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Publication #:
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Pub Dt:
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05/28/2020
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
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Assignee
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| NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 30078 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK, LLP
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280 INTERSTATE NORTH CIRCLE SE
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SUITE 550
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ATLANTA, GA 30339
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05/30/2024 01:46 PM
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