Patent Assignment Details
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Reel/Frame: | 057893/0388 | |
| Pages: | 8 |
| | Recorded: | 10/25/2021 | | |
Attorney Dkt #: | 2016P00092US02 013US1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/26/2019
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Application #:
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15951775
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Filing Dt:
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04/12/2018
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Publication #:
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Pub Dt:
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06/27/2019
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Title:
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METHOD AND SYSTEM FOR DUAL STRETCHING OF WAFERS FOR ISOLATED SEGMENTED CHIP SCALE PACKAGES
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Assignee
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370 W TRIMBLE RD |
SAN JOSE, CALIFORNIA 95131 |
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Correspondence name and address
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SCHWEGMAN LUNDBERG & WOESSNER P.A.
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P.O. BOX 2938
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MINNEAPOLIS, MN 55402
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06/07/2024 05:55 PM
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