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Reel/Frame:018879/0389   Pages: 2
Recorded: 02/12/2007
Attorney Dkt #:OP-09500841
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11673640
Filing Dt:
02/12/2007
Publication #:
Pub Dt:
08/14/2008
Title:
Method For Manufacturing Thin Keypad Assembly And Such Assembly
Assignor
1
Exec Dt:
01/11/2007
Assignee
1
268, HWA-YA 2ND ROAD, HW-YA TECH. PARK, GUEISHAN
TAOYUAN, TAIWAN
Correspondence name and address
HDLS PATENT & TRADEMARK SERVICE
4331 STEVENS BATTLE LANE
FAIRFAX, VA 22033

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