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Total properties:
12
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09297357
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Filing Dt:
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05/14/1999
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Title:
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SURFACE ACOUSTIC WAVE FILTERS
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Patent #:
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Issue Dt:
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07/15/2003
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Application #:
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09695672
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Filing Dt:
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10/24/2000
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Title:
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SURFACE ACOUSTIC WAVE FILTER HAVING DIMINISHED BANDWIDTH AND METHOD OF OPERATING THE SAME
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Patent #:
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Issue Dt:
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12/17/2002
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Application #:
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09755018
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Filing Dt:
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01/05/2001
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Title:
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WAFER-SCALE PACKAGE FOR SURFACE ACOUSTIC WAVE CIRCUIT AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09755981
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Filing Dt:
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01/05/2001
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Publication #:
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Pub Dt:
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07/11/2002
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Title:
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Module having integral surface acoustic wave circuits and method of manufacturing the same
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09755991
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Filing Dt:
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01/05/2001
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Publication #:
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Pub Dt:
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07/11/2002
| | | | |
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Title:
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HERMETICALLY SEALED DUAL-BAND SURFACE ACOUSTIC WAVE CIRCUIT MODULE
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Patent #:
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Issue Dt:
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06/17/2003
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Application #:
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09755992
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Filing Dt:
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01/05/2001
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Publication #:
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Pub Dt:
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07/11/2002
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Title:
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SYSTEM AND METHOD FOR DISSIPATING STATIC CHARGE GENERATED IN A SURFACE ACOUSTIC WAVE DEVICE
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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09821592
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Filing Dt:
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03/29/2001
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Publication #:
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Pub Dt:
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10/03/2002
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Title:
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WAFER-SCALE PACKAGE FOR SURFACE ACOUSTIC WAVE CIRCUIT AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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01/14/2003
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Application #:
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09997860
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Filing Dt:
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11/29/2001
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Title:
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HERMETIC PACKAGE FOR PYROELECTRIC-SENSITIVE ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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09/16/2003
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Application #:
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09997971
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Filing Dt:
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11/29/2001
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Title:
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HERMETIC PACKAGE FOR SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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09998368
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Filing Dt:
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11/29/2001
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Title:
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HERMETIC PACKAGE FOR MULTIPLE CONTACT-SENSITIVE ELECTRONIC DEVICES AND METHODS OF MANUFACTURING THEREOF
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Patent #:
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Issue Dt:
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10/28/2003
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Application #:
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10003157
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Filing Dt:
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04/23/2002
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Title:
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HERMETIC PACKAGE FOR SURFACE ACOUSTIC WAVE DEVICE HAVING EXPOSED DEVICE SUBSTRATE CONTACTS AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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06/01/2004
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Application #:
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10271392
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Filing Dt:
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10/15/2002
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Title:
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WAFER-SCALE PACKAGE FOR SURFACE ACOUSTIC WAVE CIRCUIT AND METHOD OF MANUFACTURING THE SAME
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|
