Patent Assignment Details
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| Reel/Frame: | 016130/0394 | |
| Pages: | 3 |
| | Recorded: | 12/23/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11021411
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Filing Dt:
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12/23/2004
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Publication #:
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Pub Dt:
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05/26/2005
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Title:
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Method for forming openings in low dielectric constant material layer
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Assignee
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| NO. 3, LI-HSIN RD. II |
| SCIENCE BASED, INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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CHARLES CH.H. WU
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98 DISCOVERY
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IRVINE, CALIFORNIA 92618-3105
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