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Patent Assignment Details
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Reel/Frame:019412/0395   Pages: 2
Recorded: 05/25/2007
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11805979
Filing Dt:
05/25/2007
Publication #:
Pub Dt:
06/26/2008
Title:
Semiconductor process for butting contact and semiconductor circuit device having a butting contact
Assignors
1
Exec Dt:
05/17/2007
2
Exec Dt:
05/17/2007
3
Exec Dt:
05/17/2007
Assignee
1
6F, NO 20, TAI YUEN STREET
CHUPEI CITY, HSIN-CHU, TAIWAN R.O.C.
Correspondence name and address
RANDY W. TUNG
TUNG & ASSOCIATES
838 W. LONG LAKE ROAD
SUITE 120
BLOOMFIELD HILLS, MICHIGAN 48302

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