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Patent Assignment Details
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Reel/Frame:013918/0396   Pages: 3
Recorded: 03/26/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/02/2004
Application #:
10396572
Filing Dt:
03/26/2003
Publication #:
Pub Dt:
09/30/2004
Title:
WAFER SCALE PACKAGE AND METHOD OF ASSEMBLY
Assignors
1
Exec Dt:
03/10/2003
2
Exec Dt:
03/10/2003
3
Exec Dt:
03/10/2003
4
Exec Dt:
03/11/2003
Assignee
1
1840 CENTURY PARK EAST
LOS ANGELES, CALIFORNIA 90067
Correspondence name and address
BIRCH STEWART KOLASCH, ET AL.
WILLIAM L. GATES
8110 GATEHOUSE ROAD
SUITE 500 EAST
FALLS CHURCH, VA 22042-1210

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