Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 060606/0398 | |
| Pages: | 5 |
| | Recorded: | 07/25/2022 | | |
| Attorney Dkt #: | P20192037US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17872366
|
Filing Dt:
|
07/25/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/10/2022
| | | | |
|
Title:
|
PLATING APPARATUS AND METHOD FOR ELECTROPLATING WAFER
|
|
|
Assignee
|
|
|
|
|
| NO. 8, LI-HSIN ROAD 6, |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
|
|
Correspondence name and address
|
| |
COOPER LEGAL GROUP LLC
|
| |
1388 RIDGE ROAD, UNIT 1
|
| |
HINCKLEY, 44233 UNITED STATES
|
Search Results as of:
05/31/2024 12:25 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
