Patent Assignment Details
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| Reel/Frame: | 020855/0399 | |
| Pages: | 3 |
| | Recorded: | 04/11/2008 | | |
| Attorney Dkt #: | 81611(71987) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12082718
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Filing Dt:
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04/11/2008
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Publication #:
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Pub Dt:
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10/16/2008
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Title:
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Fabricating method of semiconductor package and heat-dissipating structure applicable thereto
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Assignee
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| NO. 123, SEC. 3, DA FONG RD., TANTZU |
| TAICHUNG, TAIWAN ROC |
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Correspondence name and address
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PETER F. CORLESS
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EDWARDS ANGELL PALMER & DODGE LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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