Patent Assignment Details
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| Reel/Frame: | 011508/0400 | |
| Pages: | 2 |
| | Recorded: | 01/19/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/22/2003
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Application #:
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09648843
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Filing Dt:
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08/25/2000
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Title:
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PROCESS FOR PACKAGING A CHIP WITH SENSORS AND SEMICONDUCTOR PACKAGE CONTAINING SUCH A CHIP
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Assignee
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| 7, AVENUE GALLIENI |
| 94250 GENTILLY, FRANCE |
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Correspondence name and address
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FLEIT, KAIN, GIBBONS, GUTMAN ET AL
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STEPHEN BONGINI
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ONE BOCA COMMERCE CENTER
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551 NORTHWEST 77TH STREET, SUITE 111
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BOCA RATON, FLORIDA 33487
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