Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 055100/0400 | |
| Pages: | 14 |
| | Recorded: | 02/01/2021 | | |
| Attorney Dkt #: | 202414 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/26/2021
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Application #:
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16856132
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Filing Dt:
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04/23/2020
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Publication #:
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Pub Dt:
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10/28/2021
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Title:
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CAPACITOR INTERPOSER LAYER (CIL) IN A DIE-TO-WAFER THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC)
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Assignee
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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Correspondence name and address
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QUALCOMM INCORPORATED
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5775 MOREHOUSE DRIVE
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SAN DIEGO, CA 92121
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