Patent Assignment Details
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| Reel/Frame: | 052062/0405 | |
| Pages: | 4 |
| | Recorded: | 03/10/2020 | | |
| Attorney Dkt #: | 251367-1842 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/12/2022
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Application #:
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16813898
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Filing Dt:
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03/10/2020
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Publication #:
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Pub Dt:
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07/02/2020
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE
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Assignee
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| NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 30078 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK, LLP
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280 INTERSTATE NORTH CIRCLE SE
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SUITE 550
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ATLANTA, GA 30339
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05/28/2024 01:24 AM
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