Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 044914/0406 | |
| Pages: | 4 |
| | Recorded: | 02/13/2018 | | |
| Attorney Dkt #: | 1248/337B |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/21/2018
|
Application #:
|
15895575
|
Filing Dt:
|
02/13/2018
|
|
Publication #:
|
|
Pub Dt:
|
06/21/2018
| | | | |
|
Title:
|
CHIP PACKAGE HAVING CHIP CONNECTED TO SENSING DEVICE WITH REDISTRIBUTION LAYER IN INSULATOR LAYER
|
|
|
Assignee
|
|
|
|
|
| 9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
| JHONGLI DIST. |
| TAOYUAN CITY, TAIWAN 32062 |
|
|
Correspondence name and address
|
| |
WEN LIU
|
| |
350 S. FIGUEROA STREET, SUITE 975
|
| |
LOS ANGELES, CA 90071
|
Search Results as of:
05/28/2024 11:50 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
