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Reel/Frame:028004/0409   Pages: 74
Recorded: 04/06/2012
Attorney Dkt #:STW000047US1
Conveyance: DEED OF TRANSFER
Total properties: 1
1
Patent #:
Issue Dt:
05/15/2012
Application #:
11912843
Filing Dt:
10/26/2007
Publication #:
Pub Dt:
08/07/2008
Title:
INTEGRATED CIRCUIT ASSEMBLY WITH PASSIVE INTEGRATION SUBSTRATE FOR POWER AND GROUND LINE ROUTING ON TOP OF AN INTEGRATED CIRCUIT CHIP
Assignor
1
Exec Dt:
07/28/2008
Assignee
1
39 CHEMIN DU CHAMP-DES-FILLES 1228 PLAN-LES-OUATES
GENEVA, SWITZERLAND
Correspondence name and address
HOGAN LOVELLS US LLP
TWO NORTH CASCADE AVENUE
SUITE 1300
COLORADO SPRINGS, CO 80903

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