Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 054369/0409 | |
| Pages: | 6 |
| | Recorded: | 11/16/2020 | | |
| Attorney Dkt #: | BA4-0722; BA4-0764 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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17014363
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Filing Dt:
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09/08/2020
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Title:
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Assemblies, Riveted Assemblies, Methods for Affixing Substrates, and Methods for Mixing Materials to Form a Metallurgical Bond
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Assignee
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| P.O. BOX 999 |
| DEPT. K1-53 |
| RICHLAND, WASHINGTON 99352 |
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Correspondence name and address
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ROBERT C. HYTA
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601 W. MAIN AVENUE
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SUITE 600
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SPOKANE, MT 99201
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05/28/2024 03:40 AM
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