Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 043939/0411 | |
| Pages: | 5 |
| | Recorded: | 10/24/2017 | | |
| Attorney Dkt #: | 091983-0499 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15792359
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Filing Dt:
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10/24/2017
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Publication #:
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Pub Dt:
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02/21/2019
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Title:
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LEAD-FREE SOLDER COMPOSITION
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Assignees
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| 12, HEOLLEUNG-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| 12, HEOLLEUNG-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| 113-19, DANGHA-RO, NAMSA-MYEON, CHEOIN-GU |
| YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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