Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 057843/0412 | |
| Pages: | 5 |
| | Recorded: | 10/20/2021 | | |
| Attorney Dkt #: | 123224-5397-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/03/2023
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Application #:
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17505278
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Filing Dt:
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10/19/2021
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Publication #:
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Pub Dt:
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05/05/2022
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Title:
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THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT PRODUCED USING THE SAME AND HAVING IMPROVED PLATING ADHESION AND LIGHT TRANSMITTANCE
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Assignees
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| 12, HEOLLEUNG-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06797 |
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| 12, HEOLLEUNG-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06797 |
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| 300, OLYMPIC-RO, SONGPA-GU |
| SEOUL, KOREA, REPUBLIC OF 05551 |
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Correspondence name and address
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MORGAN LEWIS & BOCKIUS LLP
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1111 PENNSYLVANIA AVENUE NW
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WASHINGTON, DC 20004
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