Patent Assignment Details
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| Reel/Frame: | 034958/0413 | |
| Pages: | 3 |
| | Recorded: | 02/13/2015 | | |
| Attorney Dkt #: | 14-TPY-0305US01 (5220052) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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14589094
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Filing Dt:
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01/05/2015
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Publication #:
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Pub Dt:
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07/07/2016
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Title:
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INTEGRATED CIRCUIT (IC) PACKAGE WITH THICK DIE PAD FUNCTIONING AS A HEAT SINK
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Assignee
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| 28 ANG MO KIO INDUSTRIAL PARK 2, |
| SINGAPORE,, SINGAPORE 569508 |
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Correspondence name and address
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MICHAEL W. TAYLOR
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255 S. ORANGE AVE.
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SUITE 1401
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ORLANDO, FL 32801
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