|
Total properties:
34
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/15/1998
|
Application #:
|
08658126
|
Filing Dt:
|
06/04/1996
|
|
Title:
|
LEAD FRAME OF A SEMICONDUCTOR DEVICE AND A METHOD FOR DESIGNING IT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/1998
|
Application #:
|
08792211
|
Filing Dt:
|
01/31/1997
|
|
Title:
|
SEMICONDUCTOR LEAD FRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/28/1999
|
Application #:
|
08823691
|
Filing Dt:
|
03/25/1997
|
|
Title:
|
LEAD FRAME FOR SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/1999
|
Application #:
|
09025260
|
Filing Dt:
|
02/18/1998
|
|
Title:
|
METHOD FOR LEAD FRAME ETCHING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/14/2000
|
Application #:
|
09046656
|
Filing Dt:
|
03/24/1998
|
|
Title:
|
SEMICONDUCTOR LEAD FRAME HAVING MULTI-LAYERED PLATING LAYER INCLUDING COPPER-NICKEL PLATING LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/02/1999
|
Application #:
|
09081436
|
Filing Dt:
|
05/19/1998
|
|
Title:
|
LEAD FRAME HAVING A NI-MN ALLOY LAYER AND A PD LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/21/2000
|
Application #:
|
09260471
|
Filing Dt:
|
03/02/1999
|
|
Title:
|
LEAD FRAME FOR SEMICONDUCTOR PACKAGE AND LEAD FRAME PLATING METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2002
|
Application #:
|
09492402
|
Filing Dt:
|
01/27/2000
|
|
Title:
|
LEAD FRAME AND METHOD FOR PLATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2002
|
Application #:
|
09731766
|
Filing Dt:
|
12/08/2000
|
|
Publication #:
|
|
Pub Dt:
|
02/21/2002
| | | | |
|
Title:
|
LEAD FRAME AND METHOD OF MANUFACTURING THE LEAD FRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/11/2003
|
Application #:
|
09878341
|
Filing Dt:
|
06/12/2001
|
|
Publication #:
|
|
Pub Dt:
|
08/08/2002
| | | | |
|
Title:
|
AG-PRE-PLATED LEAD FRAME FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2008
|
Application #:
|
10923454
|
Filing Dt:
|
08/20/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/25/2005
| | | | |
|
Title:
|
LEAD FRAME FOR SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/11/2007
|
Application #:
|
10981417
|
Filing Dt:
|
11/04/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/20/2005
| | | | |
|
Title:
|
LEAD FRAME AND METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2007
|
Application #:
|
11063353
|
Filing Dt:
|
02/23/2005
|
|
Publication #:
|
|
Pub Dt:
|
08/25/2005
| | | | |
|
Title:
|
LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE WITH THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/06/2007
|
Application #:
|
11103938
|
Filing Dt:
|
04/12/2005
|
|
Publication #:
|
|
Pub Dt:
|
10/20/2005
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING MULTIPLE ROW OF LEADS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/22/2007
|
Application #:
|
11133613
|
Filing Dt:
|
05/20/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/09/2006
| | | | |
|
Title:
|
FLIP CHIP SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/02/2009
|
Application #:
|
11134138
|
Filing Dt:
|
05/20/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/09/2006
| | | | |
|
Title:
|
LEAD FRAME AND SEMICONDUCTOR DEVICE HAVING THE LEAD FRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2012
|
Application #:
|
12466655
|
Filing Dt:
|
05/15/2009
|
|
Publication #:
|
|
Pub Dt:
|
11/19/2009
| | | | |
|
Title:
|
LEAD FRAME MANUFACTURED FROM LOW-PRICED MATERIAL AND NOT REQUIRING STRICT PROCESS CONTROL, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE LEAD FRAME AND THE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/2013
|
Application #:
|
12545371
|
Filing Dt:
|
08/21/2009
|
|
Publication #:
|
|
Pub Dt:
|
03/25/2010
| | | | |
|
Title:
|
APPARATUS FOR ROLL-TO-ROLL MANUFACTURING SEMICONDUCTOR PARTS AND FEEDING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2012
|
Application #:
|
12883481
|
Filing Dt:
|
09/16/2010
|
|
Publication #:
|
|
Pub Dt:
|
04/07/2011
| | | | |
|
Title:
|
LEAD FRAME AND METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/29/2012
|
Application #:
|
12891176
|
Filing Dt:
|
09/27/2010
|
|
Publication #:
|
|
Pub Dt:
|
06/09/2011
| | | | |
|
Title:
|
METHOD OF MANUFACTURING A CIRCUIT BOARD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2014
|
Application #:
|
13116224
|
Filing Dt:
|
05/26/2011
|
|
Publication #:
|
|
Pub Dt:
|
02/23/2012
| | | | |
|
Title:
|
DEVICE-EMBEDDED FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13343347
|
Filing Dt:
|
01/04/2012
|
|
Publication #:
|
|
Pub Dt:
|
11/22/2012
| | | | |
|
Title:
|
METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTURED BY THE METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2013
|
Application #:
|
13344126
|
Filing Dt:
|
01/05/2012
|
|
Publication #:
|
|
Pub Dt:
|
04/26/2012
| | | | |
|
Title:
|
LEAD FRAME MANUFACTURED FROM LOW-PRICED MATERIAL AND NOT REQUIRING STRICT PROCESS CONTROL, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE LEAD FRAME AND THE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/20/2015
|
Application #:
|
13347915
|
Filing Dt:
|
01/11/2012
|
|
Publication #:
|
|
Pub Dt:
|
07/12/2012
| | | | |
|
Title:
|
LEAD FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/30/2014
|
Application #:
|
13416202
|
Filing Dt:
|
03/09/2012
|
|
Publication #:
|
|
Pub Dt:
|
09/13/2012
| | | | |
|
Title:
|
METHOD OF MANUFACTURING LEAD FRAME FOR LIGHT-EMITTING DEVICE PACKAGE AND LIGHT-EMITTING DEVICE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/27/2015
|
Application #:
|
13603959
|
Filing Dt:
|
09/05/2012
|
|
Publication #:
|
|
Pub Dt:
|
11/28/2013
| | | | |
|
Title:
|
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/2016
|
Application #:
|
13658870
|
Filing Dt:
|
10/24/2012
|
|
Publication #:
|
|
Pub Dt:
|
06/27/2013
| | | | |
|
Title:
|
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY USING THE METHOD
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13686168
|
Filing Dt:
|
11/27/2012
|
|
Publication #:
|
|
Pub Dt:
|
08/08/2013
| | | | |
|
Title:
|
METHOD OF PREVENTING EPOXY BLEED OUT OF LEAD FRAME AND LEAD FRAME MANUFACTURED BY USING THE SAME
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13727038
|
Filing Dt:
|
12/26/2012
|
|
Publication #:
|
|
Pub Dt:
|
07/04/2013
| | | | |
|
Title:
|
METHOD OF FORMING VIA HOLE IN CIRCUIT BOARD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/09/2016
|
Application #:
|
13924705
|
Filing Dt:
|
06/24/2013
|
|
Publication #:
|
|
Pub Dt:
|
04/24/2014
| | | | |
|
Title:
|
METHOD OF MANUFACTURING CIRCUIT BOARD AND CHIP PACKAGE AND CIRCUIT BOARD MANUFACTURED BY USING THE METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/06/2017
|
Application #:
|
13937345
|
Filing Dt:
|
07/09/2013
|
|
Publication #:
|
|
Pub Dt:
|
05/29/2014
| | | | |
|
Title:
|
REEL-TO-REEL INSPECTION APPARATUS AND INSPECTION METHOD USING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/27/2015
|
Application #:
|
13958980
|
Filing Dt:
|
08/05/2013
|
|
Publication #:
|
|
Pub Dt:
|
09/11/2014
| | | | |
|
Title:
|
LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE LEAD FRAME, AND METHOD OF MANUFACTURING THE LEAD FRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/29/2016
|
Application #:
|
14182783
|
Filing Dt:
|
02/18/2014
|
|
Publication #:
|
|
Pub Dt:
|
11/06/2014
| | | | |
|
Title:
|
METHOD OF MANUFACTURING LEAD FRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/22/2015
|
Application #:
|
14363854
|
Filing Dt:
|
06/09/2014
|
|
Publication #:
|
|
Pub Dt:
|
10/30/2014
| | | | |
|
Title:
|
LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THE SAME
|
|
