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Patent #:
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Issue Dt:
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11/12/2002
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Application #:
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09387377
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Filing Dt:
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08/30/1999
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Title:
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CIRCUIT PATTERN TAPE FOR WAFER-SCALE PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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08/20/2002
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Application #:
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09391792
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Filing Dt:
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09/08/1999
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Title:
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LEAD FRAME USED FOR THE FABRICATION OF SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR PACKAGE FABRICATED USING THE SAME
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Patent #:
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Issue Dt:
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09/24/2002
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Application #:
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09395875
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Filing Dt:
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09/14/1999
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Title:
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METHOD FOR MOLDING A LEADFRAME IN PLASTIC INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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02/11/2003
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Application #:
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09412889
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Filing Dt:
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10/05/1999
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Title:
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METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE USING A BATCH STEP FOR CURING A DIE ATTACHMENT FILM AND A TOOL SYSTEM FOR PERFORMING THE METHOD
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Patent #:
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Issue Dt:
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03/06/2001
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Application #:
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09420065
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Filing Dt:
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10/18/1999
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Title:
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THIN LEADFRAME-TYPE SEMICONDUCTOR PACKAGE HAVING HEAT SINK WITH RECESS AND EXPOSED SURFACE
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Patent #:
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Issue Dt:
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07/30/2002
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Application #:
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09421454
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Filing Dt:
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10/19/1999
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Title:
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METHODS AND A DEVICE FOR HEAT TREATMENT A SEMICONDUCTOR WAFER HAVING DIFFERENT KINDS OF IMPURITIES
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Patent #:
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Issue Dt:
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10/08/2002
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Application #:
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09422027
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Filing Dt:
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10/20/1999
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Title:
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CHIP-SCALE SEMICONDUCTOR PACKAGE OF THE FAN-OUT TYPE AND METHOD OF MANUFACTURING SUCH PACKAGES
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Patent #:
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Issue Dt:
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12/03/2002
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Application #:
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09422115
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Filing Dt:
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10/20/1999
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE
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Patent #:
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Issue Dt:
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12/18/2001
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Application #:
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09434546
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Filing Dt:
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11/05/1999
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Title:
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METHODS OF MAKING THIN INTEGRATED CIRCUIT DEVICE PACKAGES WITH IMPROVED THERMAL PERFORMANCE AND SUBSTRATES FOR MAKING THE PACKAGES
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Patent #:
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Issue Dt:
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06/17/2003
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Application #:
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09434589
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Filing Dt:
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11/05/1999
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Title:
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INTEGRATED CIRCUIT DEVICE PACKAGES AND SUBSTRATES FOR MAKING THE PACKAGES
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Patent #:
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Issue Dt:
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01/25/2005
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Application #:
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09436158
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Filing Dt:
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11/09/1999
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Title:
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SEMICONDUCTOR PACKAGE WITH EXPOSED DIE PAD AND BODY-LOCKING LEADFRAME
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Patent #:
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Issue Dt:
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09/18/2001
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Application #:
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09437013
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Filing Dt:
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11/09/1999
|
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Title:
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CHIP-SIZE SEMICONDUCTOR PACKAGES
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Patent #:
|
|
Issue Dt:
|
07/31/2001
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Application #:
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09437574
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Filing Dt:
|
11/09/1999
|
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Title:
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INTEGRATED CIRCUIT PACKAGE HAVING ADHESIVE BEAD SUPPORTING PLANAR LID ABOVE PLANAR SUBSTRATE
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Patent #:
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|
Issue Dt:
|
11/05/2002
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Application #:
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09439917
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Filing Dt:
|
11/12/1999
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Title:
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CAVITY SEMICONDUCTOR PACKAGE WITH EXPOSED LEADS AND DIE PAD AND METHOD FOR MAKING THE SAME
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Patent #:
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Issue Dt:
|
07/09/2002
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Application #:
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09440808
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Filing Dt:
|
11/15/1999
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Title:
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MICROMACHINE PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
|
10/30/2001
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Application #:
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09441115
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Filing Dt:
|
11/17/1999
|
|
Title:
|
METHOD OF MOLDING PLASTIC SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
|
09/10/2002
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Application #:
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09444035
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Filing Dt:
|
11/19/1999
|
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MAKING USING LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
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Patent #:
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Issue Dt:
|
09/30/2003
|
Application #:
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09447202
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Filing Dt:
|
11/22/1999
|
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Title:
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THIN IMAGE SENSOR PACKAGE HAVING TRANSPARENT SUBSTRATE
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Patent #:
|
|
Issue Dt:
|
05/28/2002
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Application #:
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09448538
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Filing Dt:
|
11/22/1999
|
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Title:
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THIN IMAGE SENSOR PACKAGE FABRICATION METHOD
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Patent #:
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NONE
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Issue Dt:
|
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Application #:
|
09449070
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Filing Dt:
|
11/23/1999
|
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Publication #:
|
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Pub Dt:
|
07/25/2002
| | | | |
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Title:
|
METHOD OF ATTACHING A SHEET OF AN ADHESIVE FILM TO A SUBSTRATE IN THE COURSE OF MAKING INTEGRATED CIRCUIT PACKAGES
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Patent #:
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Issue Dt:
|
10/31/2000
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Application #:
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09452454
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Filing Dt:
|
12/02/1999
|
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Title:
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SOFT TOY STRUCTURE CONTAINING THEREIN A FLUID MATERIAL AND A METHOD FOR MANUFACTURING THE SOFT TOY
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Patent #:
|
|
Issue Dt:
|
09/24/2002
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Application #:
|
09457505
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Filing Dt:
|
12/08/1999
|
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Title:
|
MOLDED IMAGE SENSOR PACKAGE
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Patent #:
|
|
Issue Dt:
|
11/19/2002
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Application #:
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09457513
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Filing Dt:
|
12/08/1999
|
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Title:
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MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER
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Patent #:
|
|
Issue Dt:
|
03/04/2003
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Application #:
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09457515
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Filing Dt:
|
12/08/1999
|
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Title:
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METHOD OF ASSEMBLING A SNAP LID IMAGE SENSOR PACKAGE
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Patent #:
|
|
Issue Dt:
|
11/19/2002
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Application #:
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09457516
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Filing Dt:
|
12/08/1999
|
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Title:
|
SNAP LID IMAGE SENSOR PACKAGE
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|
|
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Patent #:
|
|
Issue Dt:
|
05/21/2002
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Application #:
|
09457517
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Filing Dt:
|
12/08/1999
|
|
Title:
|
METHOD OF FABRICATING IMAGE SENSOR PACKAGES IN AN ARRAY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2001
|
Application #:
|
09458033
|
Filing Dt:
|
12/08/1999
|
|
Title:
|
MOLDED WINDOW ARRAY FOR IMAGE SENSOR PACKAGES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09460175
|
Filing Dt:
|
12/10/1999
|
|
Title:
|
A MICROELECTRONIC DEVICE PACKAGE HAVING A HEAT SINK STRUCTURE FOR INCREASING THE THERMAL CONDUCTIVITY OF THE PACKAGE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2002
|
Application #:
|
09461523
|
Filing Dt:
|
12/14/1999
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
09483212
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Filing Dt:
|
01/14/2000
|
|
Publication #:
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|
Pub Dt:
|
05/01/2003
| | | | |
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Title:
|
Package for multiple integrated circuits and method of making
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|
|
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Patent #:
|
|
Issue Dt:
|
11/20/2001
|
Application #:
|
09484192
|
Filing Dt:
|
01/18/2000
|
|
Title:
|
Stackable package for an integrated circuit
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Patent #:
|
|
Issue Dt:
|
07/02/2002
|
Application #:
|
09490317
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Filing Dt:
|
01/24/2000
|
|
Title:
|
PACKAGE FOR STACKED INTEGRATED CIRCUITS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/04/2003
|
Application #:
|
09490717
|
Filing Dt:
|
01/25/2000
|
|
Title:
|
PROTECTED IMAGE SENSOR PACKAGE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
01/28/2003
|
Application #:
|
09491112
|
Filing Dt:
|
01/25/2000
|
|
Title:
|
PROTECTED IMAGE SENSOR PACKAGE FABRICATION METHOD
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/02/2003
|
Application #:
|
09496991
|
Filing Dt:
|
02/02/2000
|
|
Title:
|
FABRICATING VERY THIN CHIP SIZE SEMICONDUCTOR PACKAGES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/11/2002
|
Application #:
|
09497377
|
Filing Dt:
|
02/03/2000
|
|
Title:
|
MODULE OF STACKED INTEGRATED CIRCUIT PACKAGES INCLUDING AN INTERPOSER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2002
|
Application #:
|
09498144
|
Filing Dt:
|
02/04/2000
|
|
Title:
|
Making chip size semiconductor packages
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
09504007
|
Filing Dt:
|
02/14/2000
|
|
Publication #:
|
|
Pub Dt:
|
08/01/2002
| | | | |
|
Title:
|
Method of forming an integrated circuit device package using a temporary substrate
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
|
Application #:
|
09505395
|
Filing Dt:
|
02/16/2000
|
|
Title:
|
PRINTED CIRCUIT BOARD WITH HEAT SPREADER AND METHOD OF MAKING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2006
|
Application #:
|
09513067
|
Filing Dt:
|
02/24/2000
|
|
Title:
|
NONEXPOSED HEAT SINK FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09513232
|
Filing Dt:
|
02/24/2000
|
|
Title:
|
LEADFRAME FOR MOLDED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/01/2002
|
Application #:
|
09536236
|
Filing Dt:
|
03/27/2000
|
|
Title:
|
ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES WITH CONDUCTIVE STRAPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2003
|
Application #:
|
09536830
|
Filing Dt:
|
03/27/2000
|
|
Title:
|
FLIP CHIP IMAGE SENSOR PACKAGE FABRICATION METHPD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/03/2002
|
Application #:
|
09539314
|
Filing Dt:
|
03/30/2000
|
|
Title:
|
METHOD FOR FABRICATING A SNAPABLE MULTI-PACKAGE ARRAY SUBSTRATE, SNAPABLE MULTI-PACKAGE ARRAY AND SNAPABLE PACKAGED ELECTRONIC COMPONENTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/29/2002
|
Application #:
|
09548702
|
Filing Dt:
|
04/13/2000
|
|
Title:
|
ELECTROMAGNETIC INTERFERENCE SHIELD DEVICE AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/17/2003
|
Application #:
|
09548705
|
Filing Dt:
|
04/13/2000
|
|
Title:
|
MATRIX TYPE PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2003
|
Application #:
|
09551416
|
Filing Dt:
|
04/18/2000
|
|
Title:
|
METHOD OF MAKING AN ELECTROMAGNETIC INTERFERENCE SHIELD DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2001
|
Application #:
|
09558392
|
Filing Dt:
|
04/25/2000
|
|
Title:
|
Precision marking and singulation method
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/16/2002
|
Application #:
|
09561180
|
Filing Dt:
|
04/27/2000
|
|
Title:
|
Moisture-resistant integrated circuit chip package and method
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2002
|
Application #:
|
09565586
|
Filing Dt:
|
05/04/2000
|
|
Title:
|
MOISTURE-RESISTANT INTEGRATED CIRCUIT CHIP PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2002
|
Application #:
|
09565881
|
Filing Dt:
|
05/05/2000
|
|
Title:
|
LONG WIRE IC PACKAGE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2003
|
Application #:
|
09566069
|
Filing Dt:
|
05/05/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/11/2003
|
Application #:
|
09566658
|
Filing Dt:
|
05/08/2000
|
|
Title:
|
STACKABLE PACKAGE HAVING A CAVITY AND A LID FOR AN ELECTRONIC DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09566680
|
Filing Dt:
|
05/08/2000
|
|
Title:
|
STACKABLE PACKAGE WITH HEAT SINK
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2001
|
Application #:
|
09566849
|
Filing Dt:
|
05/05/2000
|
|
Title:
|
Lowwire ic package fabrication method
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2002
|
Application #:
|
09569716
|
Filing Dt:
|
05/11/2000
|
|
Title:
|
APPARATUS FOR ELECTRICALLY MOUNTING AN ELECTRONIC DEVICE TO A SUBSTRATE WITHOUT SOLDERING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2002
|
Application #:
|
09574006
|
Filing Dt:
|
05/19/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/2002
|
Application #:
|
09577692
|
Filing Dt:
|
05/22/2000
|
|
Title:
|
IMAGE SENSOR PACKAGE HAVING SEALED CAVITY OVER ACTIVE AREA
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2002
|
Application #:
|
09585506
|
Filing Dt:
|
06/01/2000
|
|
Title:
|
REINFORCING SOLDER CONNECTIONS OF ELECTRONIC DEVICES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
09585704
|
Filing Dt:
|
05/31/2000
|
|
Publication #:
|
|
Pub Dt:
|
05/01/2003
| | | | |
|
Title:
|
Reverse contrast marked package
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2003
|
Application #:
|
09585915
|
Filing Dt:
|
06/02/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH SPACER STRIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/18/2003
|
Application #:
|
09587136
|
Filing Dt:
|
06/02/2000
|
|
Title:
|
PACKAGING HIGH POWER INTEGRATED CIRCUIT DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2001
|
Application #:
|
09591705
|
Filing Dt:
|
06/09/2000
|
|
Title:
|
Making solder ball mounting pads on substrates
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2002
|
Application #:
|
09593269
|
Filing Dt:
|
06/13/2000
|
|
Title:
|
Electronic device package and leadframe
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/10/2005
|
Application #:
|
09602162
|
Filing Dt:
|
06/22/2000
|
|
Title:
|
MATERIAL TRANSPORT METHOD
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|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2004
|
Application #:
|
09602195
|
Filing Dt:
|
06/22/2000
|
|
Title:
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ASSEMBLY FOR TRANSPORTING MATERIAL
|
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|
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2003
|
Application #:
|
09602196
|
Filing Dt:
|
06/22/2000
|
|
Title:
|
GRIPPER ASSEMBLY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2002
|
Application #:
|
09608197
|
Filing Dt:
|
06/30/2000
|
|
Title:
|
LOW PROFILE PACKAGE FOR PLURAL SEMICONDUCTOR DIES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2003
|
Application #:
|
09608357
|
Filing Dt:
|
06/29/2000
|
|
Title:
|
FLIP CHIP INTEGRATED CIRCUIT AND PASSIVE CHIP COMPONENT PACKAGE FABRICATION METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2003
|
Application #:
|
09608419
|
Filing Dt:
|
06/30/2000
|
|
Title:
|
STACKABLE PACKAGE HAVING CLIPS FOR FASTENING PACKAGE AND TOOL FOR OPENING CLIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/10/2001
|
Application #:
|
09608502
|
Filing Dt:
|
06/30/2000
|
|
Title:
|
Flip-chip micromachine package fabrication method
|
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Patent #:
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Issue Dt:
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03/12/2002
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Application #:
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09608678
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Filing Dt:
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06/29/2000
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Title:
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Electronic package having flip chip integrated circuit and passive chip component
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Patent #:
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Issue Dt:
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08/13/2002
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Application #:
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09615107
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Filing Dt:
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07/13/2000
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Title:
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PLASTIC INTERGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
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Patent #:
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Issue Dt:
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05/13/2003
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Application #:
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09615670
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Filing Dt:
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07/14/2000
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Title:
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MICROCIRCUIT DIE-SAWING PROTECTOR
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