Total properties:
13
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Patent #:
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Issue Dt:
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06/28/2005
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Application #:
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10228699
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Filing Dt:
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08/26/2002
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Publication #:
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Pub Dt:
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06/19/2003
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Title:
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PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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05/17/2005
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Application #:
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10228804
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Filing Dt:
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08/26/2002
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Publication #:
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Pub Dt:
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10/28/2004
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Title:
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Process for producing microelectromechanical components and a housed microelectromechanical component
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Patent #:
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Issue Dt:
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01/09/2007
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Application #:
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10487604
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Filing Dt:
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08/13/2004
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Publication #:
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Pub Dt:
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12/23/2004
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Title:
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METHOD FOR PRODUCING ELECTRONIC COMPONENTS
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Patent #:
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Issue Dt:
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04/20/2010
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Application #:
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10580284
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Filing Dt:
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06/25/2007
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Publication #:
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Pub Dt:
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02/14/2008
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Title:
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PROCESS FOR PACKAGING COMPONENTS, AND PACKAGED COMPONENTS
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Patent #:
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Issue Dt:
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04/20/2010
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Application #:
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10947974
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Filing Dt:
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09/22/2004
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Publication #:
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Pub Dt:
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02/24/2005
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Title:
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PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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07/04/2006
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Application #:
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10994659
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Filing Dt:
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11/22/2004
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Publication #:
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Pub Dt:
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03/24/2005
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Title:
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PROCESS FOR PRODUCING MICROELECTROMECHANICAL COMPONENTS AND A HOUSED MICROELECTROMECHANICAL COMPONENT
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Patent #:
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Issue Dt:
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10/23/2007
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Application #:
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11378962
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Filing Dt:
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03/18/2006
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Publication #:
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Pub Dt:
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07/20/2006
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Title:
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PROCESS FOR PRODUCING MICROELECTROMECHANICAL COMPONENTS AND A HOUSED MICROELECTROMECHANICAL COMPONENT
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Patent #:
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Issue Dt:
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02/14/2012
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Application #:
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11603388
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Filing Dt:
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11/22/2006
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Publication #:
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Pub Dt:
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03/22/2007
| | | | |
Title:
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METHOD FOR PRODUCING ELECTRONIC COMPONENTS
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Patent #:
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Issue Dt:
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10/26/2010
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Application #:
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12042108
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Filing Dt:
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03/04/2008
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Publication #:
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Pub Dt:
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06/26/2008
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Title:
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PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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09/13/2011
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Application #:
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12307174
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Filing Dt:
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11/05/2009
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Publication #:
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Pub Dt:
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03/11/2010
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Title:
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METHOD FOR PACKAGING ELECTRONIC DEVICES AND INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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02/01/2011
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Application #:
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12623323
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Filing Dt:
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11/20/2009
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Publication #:
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Pub Dt:
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03/18/2010
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Title:
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PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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04/16/2013
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Application #:
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12667185
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Filing Dt:
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07/20/2010
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Publication #:
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Pub Dt:
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11/11/2010
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Title:
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METHOD FOR PACKING SEMICONDUCTOR COMPONENTS AND PRODUCT PRODUCED ACCORDING TO THE METHOD
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Patent #:
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Issue Dt:
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11/13/2012
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Application #:
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12753514
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Filing Dt:
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04/02/2010
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Publication #:
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Pub Dt:
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07/29/2010
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Title:
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PROCESS FOR PACKAGING COMPONENTS, AND PACKAGED COMPONENTS
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