Patent Assignment Details
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| Reel/Frame: | 061165/0418 | |
| Pages: | 4 |
| | Recorded: | 08/12/2022 | | |
| Attorney Dkt #: | 2022-PA-3332 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/28/2021
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Application #:
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16740633
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Filing Dt:
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01/13/2020
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Publication #:
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Pub Dt:
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08/20/2020
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Title:
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INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND METHOD FOR MANUFACTURING THE SAME
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Assignees
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| 301, BLDG 5, HANWEI INTERNET OF THINGS TECHNOLOGY INDUSTRIAL PARK, NO. 32, |
| WUTONG ST., ZHENGZHOU HIGH-TECH INDUSTRIAL DEVELOPMENT ZONE |
| ZHENGZHOU, CHINA |
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| ROOM 208, BUILDING H, NORTH PARK, SHENZHEN UNIVERSITY TOWN, XILI STREET, |
| NANSHAN DISTRICT |
| SHENZHEN, CHINA |
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Correspondence name and address
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JEENAM PARK
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12234 SHADOW CREEK PKWY BLDG 5 UNIT 110
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PEARLAND, TX 77584
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06/05/2024 05:52 PM
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