Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 014114/0422 | |
| Pages: | 4 |
| | Recorded: | 05/28/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/29/2005
|
Application #:
|
10360845
|
Filing Dt:
|
02/06/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
|
Title:
|
HIGH DENSITY CHIP LEVEL PACKAGE FOR THE PACKAGING OF INTEGRATED CIRCUITS AND METHOD TO MANUFACTURE SAME
|
|
|
Assignee
|
|
|
|
|
| 2751 CENTERVILLE ROAD |
| LITTLE FALLS CENTER II |
| WILMINGTON, DELAWARE 19808 |
|
|
Correspondence name and address
|
| |
TOWNSEND AND TOWNSEND AND CREW LLP
|
| |
WILLIAM L. SHAFFER
|
| |
TWO EMBARCADERO CENTER, 8TH FLOOR
|
| |
SAN FRANCISCO, CALIFORNIA 94111-3834
|
Search Results as of:
05/29/2024 12:19 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
