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Reel/Frame:037948/0422   Pages: 5
Recorded: 03/10/2016
Attorney Dkt #:P/4076-371
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/20/2018
Application #:
15048201
Filing Dt:
02/19/2016
Publication #:
Pub Dt:
08/24/2017
Title:
APPARATUS AND METHOD FOR CUTTING A WAFER THAT IS SUBSTANTIALLY COVERED BY AN OPAQUE MATERIAL
Assignors
1
Exec Dt:
03/01/2016
2
Exec Dt:
03/01/2016
3
Exec Dt:
03/01/2016
4
Exec Dt:
03/01/2016
5
Exec Dt:
03/01/2016
Assignee
1
2 YISHUN AVENUE 7
SINGAPORE, SINGAPORE 768924
Correspondence name and address
OSTROLENK FABER LLP
1180 AVENUE OF THE AMERICAS
7TH FLOOR
NEW YORK, NY 10036

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