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Reel/Frame:044724/0424   Pages: 3
Recorded: 01/25/2018
Attorney Dkt #:18906-995
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 11
1
Patent #:
Issue Dt:
01/03/2017
Application #:
14445394
Filing Dt:
07/29/2014
Publication #:
Pub Dt:
10/01/2015
Title:
PACKAGE STRUCTURE AND ITS FABRICATION METHOD
2
Patent #:
Issue Dt:
03/21/2017
Application #:
14505973
Filing Dt:
10/03/2014
Publication #:
Pub Dt:
08/20/2015
Title:
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
3
Patent #:
Issue Dt:
03/07/2017
Application #:
14563250
Filing Dt:
12/08/2014
Publication #:
Pub Dt:
06/09/2016
Title:
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
4
Patent #:
Issue Dt:
02/28/2017
Application #:
14725447
Filing Dt:
05/29/2015
Publication #:
Pub Dt:
06/30/2016
Title:
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
5
Patent #:
NONE
Issue Dt:
Application #:
15137416
Filing Dt:
04/25/2016
Publication #:
Pub Dt:
08/18/2016
Title:
PACKAGE STRUCTURE AND ITS FABRICATION METHOD
6
Patent #:
Issue Dt:
08/28/2018
Application #:
15386456
Filing Dt:
12/21/2016
Publication #:
Pub Dt:
07/20/2017
Title:
PACKAGE SUBSTRATE
7
Patent #:
Issue Dt:
11/28/2017
Application #:
15465775
Filing Dt:
03/22/2017
Publication #:
Pub Dt:
10/19/2017
Title:
METHOD OF FABRICATING PACKAGE SUBSTRATES
8
Patent #:
NONE
Issue Dt:
Application #:
15654903
Filing Dt:
07/20/2017
Publication #:
Pub Dt:
11/02/2017
Title:
Fabrication Method OF A Package Substrate
9
Patent #:
Issue Dt:
07/23/2019
Application #:
15782943
Filing Dt:
10/13/2017
Publication #:
Pub Dt:
04/19/2018
Title:
PACKAGE STRUCTURE AND ITS FABRICATION METHOD
10
Patent #:
Issue Dt:
03/03/2020
Application #:
15786771
Filing Dt:
10/18/2017
Publication #:
Pub Dt:
05/10/2018
Title:
PACKAGE SUBSTRATE AND ASSOCIATED FABRICATION METHOD WITH VARYING DEPTHS FOR CIRCUIT DEVICE TERMINALS
11
Patent #:
Issue Dt:
09/18/2018
Application #:
15798698
Filing Dt:
10/31/2017
Publication #:
Pub Dt:
05/10/2018
Title:
PACKAGE SUBSTRATE HAVING A PLURALITY OF CHIPS ELECTRICALLY CONNECTED BY CONDUCTIVE VIAS AND WIRING BONDING
Assignor
1
Exec Dt:
12/04/2017
Assignee
1
P.O. BOX 31119 GRAND PAVILION, HIBISCUS WAY, 802 WEST BAY ROAD
GRAND CAYMAN, CAYMAN ISLANDS KY1-1205
Correspondence name and address
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
8230 BOONE BLVD, SUITE 405
VIENNA, VA 22182

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