Patent Assignment Details
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Reel/Frame: | 008701/0429 | |
| Pages: | 2 |
| | Recorded: | 08/08/1997 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/08/1998
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Application #:
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08811150
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Filing Dt:
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03/04/1997
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Title:
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STACKED CHIP PACKAGE DEVICE EMPLOYING A PLURALITY OF LEAD ON CHIP TYPE SEMICONDUCTOR CHIPS
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Assignee
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SUWON-CITY |
416, MAETAN-DONG, PALDAL-GU |
KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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JONES & VOLENTINE, L.L.P.
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RAYMOND C. JONES
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12200 SUNRISE VALLEY DRIVE, SUITE 150
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RESTON, VA 20191
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