Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025446/0431 | |
| Pages: | 11 |
| | Recorded: | 12/03/2010 | | |
| Attorney Dkt #: | 3010.000100/RFE |
| Conveyance: | RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). |
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Total properties:
10
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10762666
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Filing Dt:
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01/22/2004
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
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Patent #:
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Issue Dt:
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09/25/2007
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Application #:
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10825795
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Filing Dt:
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04/13/2004
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Publication #:
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Pub Dt:
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07/19/2007
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Title:
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NANOENGINEERED THERMAL MATERIALS BASED ON CARBON NANOTUBE ARRAY COMPOSITES
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Patent #:
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Issue Dt:
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09/19/2006
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Application #:
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10925824
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Filing Dt:
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08/24/2004
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Publication #:
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Pub Dt:
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03/03/2005
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Title:
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SYSTEM AND METHOD USING SELF-ASSEMBLED NANO STRUCTURES IN THE DESIGN AND FABRICATION OF AN INTEGRATED CIRCUIT MICRO-COOLER
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Patent #:
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Issue Dt:
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10/09/2007
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Application #:
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11207096
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Filing Dt:
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08/17/2005
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Publication #:
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Pub Dt:
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04/06/2006
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Title:
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APPARATUS AND TEST DEVICE FOR THE APPLICATION AND MEASUREMENT OF PRESCRIBED, PREDICTED AND CONTROLLED CONTACT PRESSURE ON WIRES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11265264
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Filing Dt:
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11/01/2005
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Publication #:
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Pub Dt:
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05/03/2007
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Title:
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METHOD AND APPARATUS FOR ESTABLISHING OPTIMAL THERMAL CONTACT BETWEEN OPPOSING SURFACES
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Patent #:
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Issue Dt:
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01/13/2009
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Application #:
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11386254
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Filing Dt:
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03/21/2006
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Publication #:
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Pub Dt:
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10/26/2006
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Title:
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APPARATUS FOR ATTACHING A COOLING STRUCTURE TO AN INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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02/02/2010
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Application #:
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11443669
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Filing Dt:
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05/30/2006
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Publication #:
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Pub Dt:
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12/14/2006
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Title:
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IN-CHIP STRUCTURES AND METHODS FOR REMOVING HEAT FROM INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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05/26/2009
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Application #:
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11532892
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Filing Dt:
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09/18/2006
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Publication #:
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Pub Dt:
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05/24/2007
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Title:
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INTEGRATED CIRCUIT MICRO-COOLER HAVING MULTI-LAYERS OF TUBES OF A CNT ARRAY
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Patent #:
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Issue Dt:
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06/08/2010
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Application #:
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11748867
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Filing Dt:
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05/15/2007
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Publication #:
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Pub Dt:
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06/05/2008
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Title:
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VAPOR CHAMBER HEAT SINK HAVING A CARBON NANOTUBE FLUID INTERFACE
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Patent #:
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Issue Dt:
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10/28/2008
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Application #:
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11859477
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Filing Dt:
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09/21/2007
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Publication #:
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Pub Dt:
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01/10/2008
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Title:
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APPARATUS AND METHOD FOR THE APPLICATION OF PRESCRIBED, PREDICTED, AND CONTROLLED CONTACT PRESSURE ON WIRES
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Assignee
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| 2010 NORTH FIRST STREET, SUITE 310 |
| SAN JOSE, CALIFORNIA 95131 |
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Correspondence name and address
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RAYMUND F. EICH, PH.D.
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10333 RICHMOND, SUITE 1100
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HOUSTON, TX 77042
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