Total properties:
12
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Patent #:
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Issue Dt:
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11/22/1994
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Application #:
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08068900
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Filing Dt:
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05/28/1993
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Title:
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METHOD FOR MAKING RELIABLE SELECTIVE VIA FILLS
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Patent #:
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Issue Dt:
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03/26/2002
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Application #:
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09436914
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Filing Dt:
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11/09/1999
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Title:
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CIRCUIT STRUCTURE INCLUDING GRID ARRAY PACKAGE AND METHOD OF FORMING THE SAME
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Patent #:
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Issue Dt:
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05/04/2004
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Application #:
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09528564
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Filing Dt:
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03/20/2000
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Title:
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MULTI-DIE ASSEMBLY
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Patent #:
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Issue Dt:
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01/27/2004
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Application #:
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09942436
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Filing Dt:
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08/29/2001
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Title:
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METHOD AND APPARATUS FOR COUPLING TO A DEVICE PACKAGED USING A BALL GRID ARRAY
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Patent #:
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Issue Dt:
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04/12/2005
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Application #:
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10029089
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Filing Dt:
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12/21/2001
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Title:
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METHOD FOR DETERMINING DIE PLACEMENT BASED ON GLOBAL ROUTING ARCHITECTURE
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Patent #:
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Issue Dt:
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05/04/2004
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Application #:
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10086050
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Filing Dt:
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02/27/2002
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Title:
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METHOD AND SYSTEM FOR UNIVERSAL PACKAGING IN CONJUNCTION WITH A BACK-END INTEGRATED CIRCUIT MANUFACTURING PROCESS
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10183095
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Filing Dt:
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06/26/2002
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Title:
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INTEGRATED CIRCUIT WITH IMPROVED RC DELAY
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Patent #:
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Issue Dt:
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05/17/2005
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Application #:
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10309380
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Filing Dt:
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12/03/2002
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Title:
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METHOD FOR OXIDIZING A METAL LAYER
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Patent #:
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Issue Dt:
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09/06/2005
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Application #:
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10402865
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Filing Dt:
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03/28/2003
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Title:
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LOW-K DIELECTRIC LAYER WITH OVERLYING ADHESION LAYER
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Patent #:
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Issue Dt:
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01/11/2005
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Application #:
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10672895
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Filing Dt:
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09/26/2003
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Title:
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INTEGRATED CIRCUIT WITH IMPROVED RC DELAY
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Patent #:
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Issue Dt:
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01/23/2007
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Application #:
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10988812
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Filing Dt:
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11/15/2004
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Title:
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TRENCH-BASED CAPACITOR FOR INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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03/28/2006
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Application #:
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10988813
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Filing Dt:
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11/15/2004
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Title:
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INTEGRATED CIRCUIT WITH IMPROVED RC DELAY
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