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Patent Assignment Details
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Reel/Frame:013607/0432   Pages: 6
Recorded: 09/10/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/19/2002
Application #:
09705251
Filing Dt:
11/02/2000
Title:
LEADED SEMICONDUCTOR PACKAGES AND METHOD OF TRIMMING AND SINGULATING SUCH PACKAGES
Assignor
1
Exec Dt:
10/27/2000
Assignee
1
5 YISHUN STREET 23
SINGAPORE, SINGAPORE 768442
Correspondence name and address
WOOD PHILLIPS KATZ, CLARK & MORTIMER
500 WEST MADISON STREET
CITICORP CENTER, SUITE 3800
CHICAGO, IL 60661-2511

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