Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 010653/0435 | |
| Pages: | 3 |
| | Recorded: | 03/21/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
09/11/2001
|
Application #:
|
09535509
|
Filing Dt:
|
03/24/2000
|
Title:
|
Bonding pad structure and manufacturing method thereof
|
|
Assignee
|
|
|
NO. 25, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C |
|
Correspondence name and address
|
|
J.C. PATENTS, INC.
|
|
JIAWEI HUANG
|
|
1340 REYNOLDS AVENUE, SUITE 114
|
|
IRVINE, CALIFORNIA 92614
|
Search Results as of:
10/31/2024 07:51 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|