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Reel/Frame:053620/0438   Pages: 15
Recorded: 08/27/2020
Attorney Dkt #:ADIRE.299A
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/03/2019
Application #:
16152182
Filing Dt:
10/04/2018
Publication #:
Pub Dt:
10/03/2019
Title:
STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENINGS FOR UPPER PACKAGE
Assignor
1
Exec Dt:
11/05/2018
Assignee
1
BAY F1 RAHEEN INDUSTRIAL ESTATE
LIMERICK, IRELAND
Correspondence name and address
KNOBBE, MARTENS, OLSON & BEAR, LLP
2040 MAIN STREET
14TH FLOOR
IRVINE, CA 92614

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