Patent Assignment Details
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| Reel/Frame: | 051564/0439 | |
| Pages: | 5 |
| | Recorded: | 01/21/2020 | | |
| Attorney Dkt #: | 5750/0599PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/28/2021
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Application #:
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16740633
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Filing Dt:
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01/13/2020
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Publication #:
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Pub Dt:
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08/20/2020
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Title:
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INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND METHOD FOR MANUFACTURING THE SAME
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Assignees
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| ROOM 7B05, BUILDING 213, TAIRAN INDUSTRY PARK, CHEGONGMIAO, FUTIAN DISTRICT |
| SHENZHEN, 518040, CHINA |
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| SCHOOL OF ELECTRONIC AND COMPUTER ENGINEERING, PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, PEKING UNIVERSITY |
| SHENZHEN, 518055, CHINA |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, P.C.
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4000 LEGATO ROAD, SUITE 310
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FAIRFAX, VA 22033
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05/26/2024 09:18 AM
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