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Reel/Frame:033327/0442   Pages: 4
Recorded: 07/16/2014
Attorney Dkt #:016714
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 42
1
Patent #:
Issue Dt:
09/15/1998
Application #:
08658126
Filing Dt:
06/04/1996
Title:
LEAD FRAME OF A SEMICONDUCTOR DEVICE AND A METHOD FOR DESIGNING IT
2
Patent #:
Issue Dt:
05/05/1998
Application #:
08712117
Filing Dt:
09/11/1996
Title:
MULTI-LAYERED CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
3
Patent #:
Issue Dt:
11/10/1998
Application #:
08736749
Filing Dt:
10/25/1996
Title:
LEAD FRAME TAPING APPARATUS AND TAPING METHOD
4
Patent #:
Issue Dt:
06/16/1998
Application #:
08792211
Filing Dt:
01/31/1997
Title:
SEMICONDUCTOR LEAD FRAME
5
Patent #:
Issue Dt:
09/28/1999
Application #:
08823691
Filing Dt:
03/25/1997
Title:
LEAD FRAME FOR SEMICONDUCTOR DEVICE
6
Patent #:
Issue Dt:
08/31/1999
Application #:
09025260
Filing Dt:
02/18/1998
Title:
METHOD FOR LEAD FRAME ETCHING
7
Patent #:
Issue Dt:
11/21/2000
Application #:
09026509
Filing Dt:
02/19/1998
Title:
MULTI-LAYER PLATED LEAD FRAME
8
Patent #:
Issue Dt:
03/14/2000
Application #:
09046656
Filing Dt:
03/24/1998
Title:
SEMICONDUCTOR LEAD FRAME HAVING MULTI-LAYERED PLATING LAYER INCLUDING COPPER-NICKEL PLATING LAYER
9
Patent #:
Issue Dt:
11/02/1999
Application #:
09081436
Filing Dt:
05/19/1998
Title:
LEAD FRAME HAVING A NI-MN ALLOY LAYER AND A PD LAYER
10
Patent #:
Issue Dt:
11/21/2000
Application #:
09260471
Filing Dt:
03/02/1999
Title:
LEAD FRAME FOR SEMICONDUCTOR PACKAGE AND LEAD FRAME PLATING METHOD
11
Patent #:
Issue Dt:
10/22/2002
Application #:
09492402
Filing Dt:
01/27/2000
Title:
LEAD FRAME AND METHOD FOR PLATING THE SAME
12
Patent #:
Issue Dt:
11/05/2002
Application #:
09731766
Filing Dt:
12/08/2000
Publication #:
Pub Dt:
02/21/2002
Title:
LEAD FRAME AND METHOD OF MANUFACTURING THE LEAD FRAME
13
Patent #:
Issue Dt:
10/10/2006
Application #:
10790310
Filing Dt:
03/01/2004
Publication #:
Pub Dt:
06/09/2005
Title:
FLEXIBLE PRINTED CIRCUIT BOARD
14
Patent #:
Issue Dt:
10/31/2006
Application #:
10858166
Filing Dt:
06/01/2004
Publication #:
Pub Dt:
12/01/2005
Title:
APPARATUS FOR DETECTING DEFECT IN CIRCUIT PATTERN AND DEFECT DETECTING SYSTEM HAVING THE SAME
15
Patent #:
Issue Dt:
03/11/2008
Application #:
10923454
Filing Dt:
08/20/2004
Publication #:
Pub Dt:
08/25/2005
Title:
LEAD FRAME FOR SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
16
Patent #:
Issue Dt:
09/11/2007
Application #:
10981417
Filing Dt:
11/04/2004
Publication #:
Pub Dt:
10/20/2005
Title:
LEAD FRAME AND METHOD OF MANUFACTURING THE SAME
17
Patent #:
Issue Dt:
07/31/2007
Application #:
11063353
Filing Dt:
02/23/2005
Publication #:
Pub Dt:
08/25/2005
Title:
LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE WITH THE SAME
18
Patent #:
Issue Dt:
02/06/2007
Application #:
11103938
Filing Dt:
04/12/2005
Publication #:
Pub Dt:
10/20/2005
Title:
SEMICONDUCTOR PACKAGE HAVING MULTIPLE ROW OF LEADS
19
Patent #:
Issue Dt:
05/22/2007
Application #:
11133613
Filing Dt:
05/20/2005
Publication #:
Pub Dt:
03/09/2006
Title:
FLIP CHIP SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
20
Patent #:
Issue Dt:
04/03/2007
Application #:
11133727
Filing Dt:
05/20/2005
Publication #:
Pub Dt:
02/23/2006
Title:
SUBSTRATE FOR PRODUCING SEMICONDUCTOR PACKAGES
21
Patent #:
Issue Dt:
06/02/2009
Application #:
11134138
Filing Dt:
05/20/2005
Publication #:
Pub Dt:
03/09/2006
Title:
LEAD FRAME AND SEMICONDUCTOR DEVICE HAVING THE LEAD FRAME
22
Patent #:
Issue Dt:
02/07/2012
Application #:
12466655
Filing Dt:
05/15/2009
Publication #:
Pub Dt:
11/19/2009
Title:
LEAD FRAME MANUFACTURED FROM LOW-PRICED MATERIAL AND NOT REQUIRING STRICT PROCESS CONTROL, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE LEAD FRAME AND THE SEMICONDUCTOR PACKAGE
23
Patent #:
Issue Dt:
12/10/2013
Application #:
12545371
Filing Dt:
08/21/2009
Publication #:
Pub Dt:
03/25/2010
Title:
APPARATUS FOR ROLL-TO-ROLL MANUFACTURING SEMICONDUCTOR PARTS AND FEEDING METHOD THEREOF
24
Patent #:
Issue Dt:
08/16/2011
Application #:
12639475
Filing Dt:
12/16/2009
Publication #:
Pub Dt:
07/29/2010
Title:
ADHESIVE TAPE AND SEMICONDUCTOR PACKAGE USING THE SAME
25
Patent #:
Issue Dt:
11/27/2012
Application #:
12883481
Filing Dt:
09/16/2010
Publication #:
Pub Dt:
04/07/2011
Title:
LEAD FRAME AND METHOD OF MANUFACTURING THE SAME
26
Patent #:
Issue Dt:
05/29/2012
Application #:
12891176
Filing Dt:
09/27/2010
Publication #:
Pub Dt:
06/09/2011
Title:
METHOD OF MANUFACTURING A CIRCUIT BOARD
27
Patent #:
Issue Dt:
03/18/2014
Application #:
13116224
Filing Dt:
05/26/2011
Publication #:
Pub Dt:
02/23/2012
Title:
DEVICE-EMBEDDED FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
28
Patent #:
NONE
Issue Dt:
Application #:
13343347
Filing Dt:
01/04/2012
Publication #:
Pub Dt:
11/22/2012
Title:
METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTURED BY THE METHOD
29
Patent #:
Issue Dt:
01/15/2013
Application #:
13344126
Filing Dt:
01/05/2012
Publication #:
Pub Dt:
04/26/2012
Title:
LEAD FRAME MANUFACTURED FROM LOW-PRICED MATERIAL AND NOT REQUIRING STRICT PROCESS CONTROL, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE LEAD FRAME AND THE SEMICONDUCTOR PACKAGE
30
Patent #:
Issue Dt:
01/20/2015
Application #:
13347915
Filing Dt:
01/11/2012
Publication #:
Pub Dt:
07/12/2012
Title:
LEAD FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
31
Patent #:
NONE
Issue Dt:
Application #:
13414793
Filing Dt:
03/08/2012
Publication #:
Pub Dt:
11/29/2012
Title:
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
32
Patent #:
Issue Dt:
09/30/2014
Application #:
13416202
Filing Dt:
03/09/2012
Publication #:
Pub Dt:
09/13/2012
Title:
METHOD OF MANUFACTURING LEAD FRAME FOR LIGHT-EMITTING DEVICE PACKAGE AND LIGHT-EMITTING DEVICE PACKAGE
33
Patent #:
NONE
Issue Dt:
Application #:
13559703
Filing Dt:
07/27/2012
Publication #:
Pub Dt:
06/13/2013
Title:
LENS APPARATUS FOR INSPECTING OBJECT AND MACHINE VISION SYSTEM INCLUDING THE SAME
34
Patent #:
Issue Dt:
10/27/2015
Application #:
13603959
Filing Dt:
09/05/2012
Publication #:
Pub Dt:
11/28/2013
Title:
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
35
Patent #:
Issue Dt:
12/27/2016
Application #:
13658870
Filing Dt:
10/24/2012
Publication #:
Pub Dt:
06/27/2013
Title:
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY USING THE METHOD
36
Patent #:
NONE
Issue Dt:
Application #:
13686168
Filing Dt:
11/27/2012
Publication #:
Pub Dt:
08/08/2013
Title:
METHOD OF PREVENTING EPOXY BLEED OUT OF LEAD FRAME AND LEAD FRAME MANUFACTURED BY USING THE SAME
37
Patent #:
NONE
Issue Dt:
Application #:
13727038
Filing Dt:
12/26/2012
Publication #:
Pub Dt:
07/04/2013
Title:
METHOD OF FORMING VIA HOLE IN CIRCUIT BOARD
38
Patent #:
NONE
Issue Dt:
Application #:
13756942
Filing Dt:
02/01/2013
Publication #:
Pub Dt:
08/01/2013
Title:
METHOD OF FORMING SOLDER RESIST LAYER AND PRINTED CIRCUIT BOARD COMPRISING SOLDER RESIST LAYER
39
Patent #:
Issue Dt:
02/09/2016
Application #:
13924705
Filing Dt:
06/24/2013
Publication #:
Pub Dt:
04/24/2014
Title:
METHOD OF MANUFACTURING CIRCUIT BOARD AND CHIP PACKAGE AND CIRCUIT BOARD MANUFACTURED BY USING THE METHOD
40
Patent #:
Issue Dt:
06/06/2017
Application #:
13937345
Filing Dt:
07/09/2013
Publication #:
Pub Dt:
05/29/2014
Title:
REEL-TO-REEL INSPECTION APPARATUS AND INSPECTION METHOD USING THE SAME
41
Patent #:
Issue Dt:
10/27/2015
Application #:
13958980
Filing Dt:
08/05/2013
Publication #:
Pub Dt:
09/11/2014
Title:
LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE LEAD FRAME, AND METHOD OF MANUFACTURING THE LEAD FRAME
42
Patent #:
Issue Dt:
03/29/2016
Application #:
14182783
Filing Dt:
02/18/2014
Publication #:
Pub Dt:
11/06/2014
Title:
METHOD OF MANUFACTURING LEAD FRAME
Assignor
1
Exec Dt:
04/30/2014
Assignee
1
84, JEONGDONG-RO, SEONGSAN-GU,
GYEONGSANGNAM-DO,
CHANGWON-SI, KOREA, REPUBLIC OF 641-120
Correspondence name and address
SUGHRUE MION
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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