Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025240/0444 | |
| Pages: | 2 |
| | Recorded: | 11/03/2010 | | |
| Attorney Dkt #: | 50138-P004US |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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12/28/2010
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Application #:
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12400391
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Filing Dt:
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03/09/2009
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Publication #:
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Pub Dt:
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09/09/2010
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Title:
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LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD
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Patent #:
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Issue Dt:
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05/27/2014
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Application #:
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12775711
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Filing Dt:
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05/07/2010
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Publication #:
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Pub Dt:
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09/09/2010
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Title:
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LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD
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Assignee
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| UNIT E, 9TH FLOOR METEX HOUSE |
| 28 FUI YIU KOK STREET |
| TSUEN WAN, NEW TERRITORIES, HONG KONG |
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Correspondence name and address
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STANLEY R. MOORE
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WINSTEAD PC
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P.O. BOX 50784
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DALLAS, TX 75201
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