Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058466/0446 | |
| Pages: | 3 |
| | Recorded: | 12/22/2021 | | |
| Attorney Dkt #: | 1248/369A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17560196
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Filing Dt:
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12/22/2021
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Publication #:
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Pub Dt:
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07/07/2022
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Title:
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SEMICONDUCTOR DEVICE STRUCTURE AND SEMICONDUCTOR PACKAGE ASSEMBLY
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Assignee
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| 9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
| JHONGLI DIST. |
| TAOYUAN CITY, TAIWAN 32062 |
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Correspondence name and address
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WEN LIU
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350 S. FIGUEROA STREET, SUITE 975
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LOS ANGELES, CA 90071
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