Patent Assignment Details
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Reel/Frame: | 050180/0447 | |
| Pages: | 3 |
| | Recorded: | 08/27/2019 | | |
Attorney Dkt #: | 17TPY0760US02/817063.435 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/08/2022
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Application #:
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16550775
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Filing Dt:
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08/26/2019
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Publication #:
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Pub Dt:
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03/05/2020
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Title:
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SOLDER MASK FOR THERMAL PAD OF A PRINTED CIRCUIT BOARD TO PROVIDE RELIABLE SOLDER CONTACT TO AN INTEGRATED CIRCUIT
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Assignee
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28 ANG MO KIO INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569508 |
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Correspondence name and address
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SEED IP LAW GROUP
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701 5TH AVE
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SUITE 5400
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SEATTLE, WA 98104
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05/27/2024 11:24 AM
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