Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 010381/0449 | |
| Pages: | 36 |
| | Recorded: | 11/16/1999 | | |
| Conveyance: | SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
8
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Patent #:
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Issue Dt:
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12/04/2001
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Application #:
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08116305
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Filing Dt:
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09/03/1993
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Title:
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MOLDED PLASTIC PACKAGE WITH HEAT SINK AND ENHANCED ELECTRICAL PERFORMANCE
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Patent #:
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Issue Dt:
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03/14/1995
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Application #:
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08116944
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Filing Dt:
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09/03/1993
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Title:
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TAB GRID ARRAY
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Patent #:
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Issue Dt:
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04/25/1995
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Application #:
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08201869
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Filing Dt:
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02/25/1994
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Title:
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PROCESS FOR ASSEMBLING A TAB GRID ARRAY PACKAGE FOR AN INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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01/21/1997
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Application #:
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08348288
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Filing Dt:
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11/30/1994
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Title:
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HIGH POWER DISSIPATION PLASTIC ENCAPSULATED PACKAGE FOR INTEGRATED CIRCUIT DIE
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Patent #:
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Issue Dt:
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12/01/1998
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Application #:
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08585134
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Filing Dt:
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01/11/1996
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Title:
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STRUCTURE AND METHOD FOR AUTOMATED ASSEMBLY OF A TAB GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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08/29/2000
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Application #:
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09020903
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Filing Dt:
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02/05/1998
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Title:
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INTEGRATED CARRIER RING/STIFFENER AND METHOD FOR MANUFACTURING A FLEXIBLE INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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05/08/2001
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Application #:
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09095803
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Filing Dt:
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06/10/1998
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Title:
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SAW-SINGULATED LEADLESS PLASTIC CHIP CARRIER
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Patent #:
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Issue Dt:
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09/04/2001
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Application #:
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09184787
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Filing Dt:
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11/02/1998
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH BONDING PLANES ON A CERAMIC RING USING AN ADHESIVE ASSEMBLY
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Assignee
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| 270 PARK AVENUE |
| NEW YORK, NEW YORK 10017 |
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Correspondence name and address
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CRAVATH, SWAINE & MOORE
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CHIANN BAO
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WORLDWIDE PLAZA , 44TH FLOOR
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825 EIGHTH AVENUE
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NEW YORK, NY 10019
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